Jet Soldering Cooling Layout for Early Solder Curing
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Solution Overview
Problem
Insufficient curing of solder, particularly with low-temperature molten solder, leads to embrittlement, as seen in conventional jet soldering apparatuses that lack early cooling mechanisms.
Innovation Solution
The apparatus incorporates a cooling unit positioned downstream of the supply port, comprising a lower and upper cooling unit that supplies gas from below and above the substrate, respectively, to cool the solder immediately after application, using air at room temperature to prevent embrittlement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If only a cooling zone is installed downstream as in related art, then the substrate can be cooled after solder application, but the solder curing is insufficient and embrittlement occurs
Solution Approach 1:
The cooling unit is positioned upstream of the supply port in the substrate conveyance direction, enabling cooling action to be performed before the solder application is complete. This preliminary cooling prevents solder embrittlement by ensuring the solder is cooled sufficiently before and during the application process, rather than waiting until after application as in traditional cooling zones.
2Reliability
If cooling is delayed until the cooling zone in related art, then the apparatus structure is simple, but solder embrittlement occurs due to insufficient cooling
Solution Approach 1:
The cooling unit is positioned in the upstream direction relative to the supply port, changing the traditional downstream cooling zone configuration. This spatial repositioning allows cooling to occur at an earlier stage in the process while maintaining apparatus simplicity, resolving the contradiction between reliability and device complexity.
3Reliability
If early cooling is implemented upstream of supply port, then solder curing is improved and embrittlement is prevented, but the cooling unit position becomes more complex
Solution Approach 1:
By positioning the cooling unit upstream of the supply port, the cooling action is performed preliminarily before and during solder application. This ensures complete solder curing and prevents embrittlement without requiring complex multi-stage cooling systems, as the single upstream cooling unit performs the critical cooling function at the optimal timing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents solder embrittlement by initiating curing sooner than conventional methods, ensuring robust solder attachment and reducing material waste and costs.
Implementation Method 1
a cooling unit configured to supply gas... the cooling unit supplies air at a room temperature as the gas
Data Source
AI summary
A jet soldering apparatus 100 has a storage tank 110 configured to store molten solder; a supply port 125, 135 for supplying the molten solder to a substrate 200; and a cooling unit 310, 330 that is positioned on a downstream side of the supply port 125, 135 in a conveyance direction of the substrate 200, is provided at an upper position of the storage tank 110, and is configured to supply gas.