Through-Hole Solder Jetting for High-Fill Pin Connections

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Solution Overview

Problem

Existing methods for soldering electronic components with pins into circuit boards with through holes are inefficient, particularly in achieving high filling degrees of solder in the annular gaps, which is crucial for strong mechanical and electrical connections.

Innovation Solution

A method involving the jetting of a liquefied solder ball onto a circuit board, where the solder ball is produced by energizing a solid solder ball with a laser beam and then jetted towards a through hole, allowing a portion to flow into and fill the annular gap between the pin and the through hole.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional soldering methods are used, then the soldering process is simple, but the filling degree of the annular gap is insufficient and mechanical strength is reduced

Engineering Contradiction:

Improvemechanical strengthVSAvoidfilling degree

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent changes the physical state parameter of solder from solid to liquid by heating it above its melting point, enabling the liquid solder to flow into and fill the annular gap effectively, thereby achieving both high filling degree and strong mechanical connection

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces traditional mechanical soldering methods with a jetting system that uses pressurized gas to propel liquid solder into the annular gap, providing precise control over solder placement and filling degree while enhancing mechanical strength

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If more solder is applied to increase filling degree, then mechanical strength improves, but soldering time increases and productivity decreases

Engineering Contradiction:

Improveconnection strengthVSAvoidsoldering speed

Core Design Contradiction:

StrengthVSProductivity

Solution Approach 1:

The jetting system using pressurized gas replaces slow traditional soldering methods, enabling rapid delivery of precisely controlled solder volumes to fill the annular gap quickly while achieving high connection strength, thus improving productivity without sacrificing quality

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

By controlling the volume and pressure of liquid solder delivered through the jetting system, the patent achieves optimal filling degree in a single rapid operation, eliminating the need for repeated soldering cycles and thereby increasing production speed

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If liquid solder is used to improve flow and filling, then filling degree increases, but control precision over solder application becomes more difficult

Engineering Contradiction:

Improvefilling degreeVSAvoidcontrol precision

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent employs a controlled jetting system using pressurized gas to deliver liquid solder, providing precise control over solder flow rate, direction, and volume, thereby making liquid solder application as controllable as traditional methods while achieving superior filling results

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system monitors and controls the jetting parameters such as gas pressure and solder flow to ensure precise delivery of the required solder volume into the annular gap, maintaining ease of operation while achieving high manufacturing precision

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures a high filling degree of the annular gap with solder, achieving strong mechanical and electrical connections between the pin and the through hole, while also reducing the time required for soldering and allowing for precise control of solder application.

Implementation Method 1

a solid solder ball is supplied with energy from a laser beam so as to produce the liquefied solder ball

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

a solid solder ball is supplied with energy from a laser beam so as to produce the liquefied solder ball

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 3

a portion of the liquefied solder ball flows into and fills an annular gap between the pin and the through hole

Methodology Applied

Scientific EffectGravity-driven flow: Gravitation

Data Source

PatentUS12349287B2Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole

Publication Date: 2025.07.01 PAC TECH PACKAGING TECH

AI summary

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.