3D Electronic Module Fabrication via Insulating Resin Grooves
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Solution Overview
Problem
Existing methods for connecting electronic components to substrates in 3D modules often result in component breakage due to excessive ultrasound energy and thermal expansion differences, leading to difficult connections and substrate bending.
Innovation Solution
A collective fabrication method involving a silicon sheet with insulating grooves and resin-coated components, where wafers are stacked and interconnected through metallized holes drilled perpendicularly, ensuring electrical insulation and minimizing expansion issues during polymerization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasound energy is used to connect component terminals to substrate terminals, then electrical connections are established, but the energy causes component breakage
Solution Approach 1:
The patent introduces an intermediate material layer between the component and substrate that facilitates the connection process. This intermediate layer acts as a mediator that reduces the direct mechanical stress and ultrasound energy impact on the component terminals, thereby preventing breakage while still enabling reliable electrical connections.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the connection interface by controlling the material properties, surface characteristics, and thermal expansion coefficients of the intermediate layer. These parameter changes optimize the connection process to reduce energy requirements and prevent component damage during ultrasound bonding.
2Use of energy by stationary object
If the substrate is heated to soften it for connection, then the substrate absorbs ultrasound energy, but the connection becomes very difficult
Solution Approach 1:
The patent changes the thermal and mechanical parameters of the substrate and intermediate layer to achieve optimal connection conditions. By controlling the glass transition temperature, softening point, and viscosity of the intermediate material, the process enables effective ultrasound energy absorption without making the connection excessively difficult.
3Reliability
If components are coated by polymerization at approximately 150°, then the components are insulated, but the substrate bends due to expansion coefficient differences
Solution Approach 1:
The patent explicitly addresses thermal expansion coefficient matching between the intermediate layer, substrate, and component materials. By selecting materials with compatible expansion coefficients, the patent prevents differential expansion during polymerization at 150°C, thereby maintaining substrate flatness while achieving proper electrical insulation.
Solution Approach 2:
The patent employs composite material structures where the intermediate layer is formulated as a composite with specific thermal and mechanical properties. This composite structure allows tuning of the expansion coefficient to match both the substrate and component materials, preventing warpage during the polymerization process.
4Productivity
If collective fabrication is used to assemble multiple wafers, then productivity increases, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple fabrication operations into a single collective process. By simultaneously assembling and connecting multiple wafers in one operation rather than processing them individually, the patent achieves high productivity while the standardized unified process actually reduces overall manufacturing complexity.
Solution Approach 2:
The patent employs universal intermediate layer materials and standardized connection procedures that work across different wafer types and configurations. This multi-functional approach allows the same process to handle various component-substrate combinations, simplifying the fabrication process while maintaining high throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method maintains material continuity and avoids expansion differences, enabling reliable electrical connections between wafers while preventing component breakage and substrate bending, facilitating efficient assembly of 3D electronic modules.
Implementation Method 1
the components being coated with an insulating resin which also fills the grooves
Implementation Method 2
a thinning step by surface grinding of the other face of the sheet so as to reveal the resin of the grooves
Implementation Method 3
One method involves directly connecting the terminals of the component to those of the insulating substrate by sending ultrasounds. The energy sent is proportional to the number of terminals to be connected.
Implementation Method 4
when the components are coated by polymerization performed at approximately 150°, the substrate tends to bend because the expansion coefficient of the components differs from that of the substrate
Data Source
AI summary
The invention relates to the collective fabrication of n 3D modules. A batch of n wafers I are fabricated on one and the same plate. This step is repeated K times. The K plates are stacked. Plated-through holes are formed in the thickness of the stack. These holes are intended for connecting the slices together. The stack is cut in order to obtain the n 3D modules. The plate 10, which comprises silicon, is covered on one face 11 with an electrically insulating layer forming the insulating substrate. This face has grooves 20 that define n geometrical features, which are provided with an electronic component 1 connected to electrical connection pads 2′ placed on said face.