Printed Circuit Assembling TRIZ Cases

Parallel flexible substrates form a cavity housing a rigid section, reducing crosstalk and electromagnetic interference without increasing spatial demands.

Multi-stage pressure and temperature modulation eliminates bubbles in sub-50 micrometer gaps, preventing back pack phenomenon during miniaturization.

Integrates X-ray imaging with muon detection data to resolve high atomic number materials in shipping containers.

Dynamic flexible circuit changes shape without external forces by using actuator wires that impart motion through thermal expansion.

A dual-sided electronic device module uses flexible printed circuit boards to integrate components on opposite board surfaces.

A printed circuit board uses a bridge disposed in an insulating layer cavity and connected to a via through a bonding layer containing conductive particles.

A circuit board socket uses a pivoting rail frame to clamp integrated circuits against an insulating housing for secure electrical connection.

Acute angle optical axes reduce subassembly volume to enable dual integration in passive optical modules.

A module-embedded multilayer circuit board stacks passive components vertically within through openings to reduce horizontal footprint.

Side coupling reduces mounting area and suppresses noise while minimizing parasitic capacitance that lowers self resonance frequency.

Metal-coated vias shield ceramic substrate edges, reducing device volume while blocking electromagnetic interference.

Conformal shield layer interfaces with a ground layer to envelop circuitry within a self-shielded component.

Wire bonding replaces print-and-etch methods on flexible substrates, eliminating hazardous chemical waste while maintaining stable electrical connections.

Temperature gradients accelerate intermetallic growth to suppress stress and enhance electromigration resistance without degrading pre-applied resins.

Variable curvature radii in flexible wiring board regions reduce stress concentration and improve bonding strength against curved display panel detachment.

An empty through hole with exposed conductive film eliminates lengthy metallic filling while reducing thermal stress on the film.

Non-linear locking edges on a flexible cover layer disperse stress at mounting portions, preventing solder separation and conduction failures.

Asymmetric conductor layers on multilayer substrates reduce interface stress between insulating sheets.

A 3D antenna mounts perpendicular to the PCB using spring clips, maintaining signal strength in compact dongles.

Direct conductive polymer deposition merges antenna fabrication with IC chip assembly, resolving alignment precision and reducing manufacturing complexity.

A rigid chassis maintains spaced printed circuit boards to eliminate handling imprecision and ensure precise thermal interface material application.

A segmented wire bonding head uses matched contact surfaces to establish ultrasonic connections on inclined bond bodies.

Transparent wiring electrodes in display panels utilize IGZO materials to maintain low electrical resistivity.

A beam detector mounts onto a substrate using solder cream portions applied beyond copper foil patterns to enable self-alignment during reflow.

Electrically conductive adhesive extends over wires onto support layers, enhancing bonding strength and heat dissipation.

Vertical sidewalls in overmolded insulating layers guide interconnecting devices, resolving lateral misalignment during automated laser welding.

A conductive carrier transmits heat and electrical energy from embedded power chips to a circuit layer.

Stacking flexible circuit boards creates parallel power paths for higher current delivery.

A screen printing paste supply apparatus extends ejecting member pressure after limit detection to ensure complete container ejection.

Separating vias from connection terminals via an intermediary wiring pattern reduces mounting pitch while preventing short circuits and underfill voids.

Surface-mounted locating pins secure printed circuit boards to standardized backboards during manufacturing.

LIGA fabrication merges comb drive switches with quasi-lumped filters to reduce volume while maintaining high-Q performance.

A semiconductor device uses larger contact area solder portions to enhance bonding strength between electrodes and the mounting substrate.

Sn-Zn alloy solder composition with controlled Zn, Ag, and Al content enables reliable electronic connections without lead contamination.

A tapered electrode pad design increases bonding strength to insulating layers in multilayer wiring boards.

Segmented via structures relax thermal stress concentration at lowermost layers, preventing via destruction and ensuring reliable electrical connections.

Neural networks analyze component displacement to generate corrective layout data, resolving manufacturing precision trade-offs without complex equipment.

Raised supports isolate soldered devices from bonding pads on the base substrate, preventing short circuits during assembly and improving product yield.

Solder connection element with resilient feet accommodates thermal expansion differences between glass and metal.

Slit electrodes in wiring boards release soldering gas to prevent voids and improve joining reliability.

Surrounds a bending area with a first film member to reduce breakage risk and stress on internal components.

A semi-cured prepreg joins a bus bar to a circuit board while a sheet-like layer contains the resin.

Counter substrate bump structure transmits bonding pressure directly to connection bumps, preventing circuit damage from uniform surface plate force.

Stacking silicon wafers with insulating resin grooves and drilling metallized holes prevents component breakage and substrate bending during polymerization.

Tin electroplating composition with sulfopropylated surfactants reduces surface roughness and void formation for reliable solder joints.

Plated-through holes connect printed circuit board regions to a conductive layer, resolving warping from thermal expansion differences.

Misaligned mounting portions reduce adjacent terminal distance while preventing interference.