Conductive Adhesive Wire Bonding Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for electrically coupling bonded components often lack effective solutions for enhancing both physical and electrical bonding, particularly in ensuring strong adhesion between conductive wires and additional components while facilitating heat dissipation.
Innovation Solution
A method and system involving a support layer with an electrically conductive wire and an electrically conductive adhesive that extends beyond the wire onto the support layer, allowing for strong adhesion to the support layer and additional components, with optional heat spreaders for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding methods are used to electrically couple components, then the structure is simple, but the bonding strength and heat dissipation capability are insufficient
Solution Approach 1:
The patent combines bonding and electrical coupling functions into a single electrically conductive adhesive layer. The adhesive simultaneously bonds the wire to the support layer and provides electrical conductivity, eliminating the need for separate bonding and electrical connection steps. This merging approach enhances bonding strength while avoiding proportional increases in structural complexity.
Solution Approach 2:
The patent uses an electrically conductive adhesive that combines bonding properties with electrical conductivity in a single composite material. This composite adhesive layer performs dual functions: mechanical bonding between the wire and support layer, and electrical signal transmission. The composite nature of the material resolves the contradiction by providing both strong bonding and functional complexity without requiring multiple separate components.
2Strength
If the adhesive is applied only on the wire, then the material usage is minimal, but the adhesion to the support layer is insufficient
Solution Approach 1:
The patent extends the adhesive application from a one-dimensional wire surface to a two-dimensional area that includes both the wire and the underlying support layer. By applying the adhesive in this expanded dimensional footprint, the bonding interface is significantly increased, providing stronger adhesion to the support layer without requiring excessive adhesive material concentration in any single location.
3Temperature
If additional components are bonded without proper thermal management, then the assembly is simple, but heat dissipation is insufficient
Solution Approach 1:
The electrically conductive adhesive layer serves multiple functions simultaneously: it provides mechanical bonding, electrical conductivity, and thermal management. By making the adhesive multi-functional, the patent addresses heat dissipation needs without requiring separate thermal management components, thus improving temperature control while minimizing increases in assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances both physical and electrical coupling between components, with the adhesive bonding more strongly to the support layer than the wire, thereby improving the overall bonding strength and facilitating heat dissipation, thus addressing the challenges of existing methods.
Implementation Method 1
the electrically conductive adhesive being configured to adhesively bond to the support layer, the electrically conductive adhesive being configured to adhesively bond to one or more additional components above the electrically conductive adhesive
Implementation Method 2
the electrically conductive adhesive being electrically coupled to the electrically conductive wire, the electrically conductive wire being configured to be electrically coupled to the one or more additional components through the electrically conductive adhesive
Data Source
AI summary
Methods and systems for electrically coupling bonded components, including: a support layer, an electrically conductive wire supported by the support layer, and an electrically conductive adhesive, the electrically conductive adhesive being over the electrically conductive wire, the electrically conductive adhesive being electrically coupled to the electrically conductive wire, the electrically conductive adhesive extending beyond the electrically conductive wire onto the support layer, the electrically conductive adhesive being configured to adhesively bond to the support layer, the electrically conductive adhesive being configured to adhesively bond to one or more additional components above the electrically conductive adhesive, the electrically conductive wire being configured to be electrically coupled to the one or more additional components through the electrically conductive adhesive.