Flexible Circuit Board Power Supply Path Stacking
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Solution Overview
Problem
Flexible circuit boards face challenges in providing sufficient electrical power due to the increasing number of signal transmission lines and decreasing line widths, with existing designs failing to meet the demand for enlarged power supply and grounding paths.
Innovation Solution
Stacking at least two flexible circuit boards in a parallel-connected configuration, with electric conduction structures like silver, aluminum, or conductive carbon paste, to form a power supply or grounding path, allowing for increased electrical power delivery while accommodating reduced line widths and increased signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of signal transmission lines is increased, then the signal transmission capability is improved, but the line width of conductive paths must be reduced
Solution Approach 1:
The patent transitions from a single-plane two-dimensional layout to a three-dimensional stacked configuration. Multiple flexible circuit boards are stacked vertically with power supply paths arranged in different layers, enabling parallel-connected power supply paths that provide sufficient power while maintaining reduced line widths on each individual board.
2Volume of moving object
If the line width of conductive paths is reduced, then the compactness of the flexible circuit board is improved, but the power supply capability deteriorates
Solution Approach 1:
The patent merges multiple power supply paths from different stacked flexible circuit boards into a parallel-connected power supply system. The first power supply path on the first flexible circuit board and the second power supply path on the second flexible circuit board are electrically connected in parallel, combining their power supply capabilities to achieve sufficient total power delivery while each individual path maintains a reduced width for compactness.
3Quantity of substance
If the number of signal transmission pins is increased, then the signal transmission capacity is improved, but the device complexity increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking flexible circuit boards to accommodate increased signal transmission requirements. Instead of expanding horizontally with more pins on a single board, the solution stacks multiple boards vertically, each with reduced pin counts, thereby achieving high signal transmission capacity while maintaining lower individual board complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables flexible circuit boards to supply sufficient electrical power and meet the demands of expanded signal transmission and power requirements, while also allowing for compact designs that can fit through narrow spaces.
Implementation Method 1
a first electric conduction structure is deposited and fixed in the first through hole... a second electric conduction structure is deposited and fixed in the second through hole... The first electric conduction structure and the second electric conduction structure are each formed of one of silver, aluminum, copper, tin, conductive carbon paste, conductive-particle-contained adhesive
Data Source
AI summary
A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.