Circuit Board Socket Rail Frame Pivoting Clamping
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Solution Overview
Problem
Conventional LGA socket designs face issues with clamping mechanisms that can introduce torque and require heat sinks with pedestals, affecting land-to-contact positioning and thermal contact efficiency.
Innovation Solution
A circuit board socket design featuring a stiffener frame, insulating housing, rail frame with a centrally located offset movement tab, and a force frame that pivots to clamp the integrated circuit, allowing for secure electrical connection and thermal contact without a pedestal heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spring loaded lid clamping mechanism is used, then the integrated circuit can be secured in the socket, but torque is introduced during assembly which affects land-to-contact positioning precision
Solution Approach 1:
The clamping mechanism is divided into separate functional components: a rail frame for positioning, a force frame for clamping, and a heat sink assembly. This segmentation allows each component to perform its specific function without interfering with the positioning precision of other components, thereby maintaining both clamping security and positioning accuracy.
Solution Approach 2:
Instead of using a traditional spring-loaded lid that pivots and introduces torque, the invention uses a force frame that applies clamping force directly through a lever mechanism. The clamping action is inverted from a pivoting motion to a direct pressing motion, eliminating the torque that would otherwise affect land-to-contact positioning.
2Adaptability or versatility
If a spring loaded lid with space between lid and package is used, then the integrated circuit can be accommodated, but a pedestal is required which reduces thermal contact efficiency
Solution Approach 1:
The pedestal component is completely removed from the design. The rail frame is designed to directly support the integrated circuit package without requiring an intermediary pedestal structure, thereby achieving full thermal contact between the heat sink and the package while still accommodating the package securely.
Solution Approach 2:
The rail frame serves multiple functions simultaneously: it provides mechanical support for the integrated circuit package, ensures proper positioning for land-to-contact alignment, and enables direct thermal contact with the heat sink. This multi-functionality eliminates the need for separate pedestal and heat sink mounting structures.
3Reliability
If levers are used to hold the spring loaded lid in position, then the clamping mechanism can be secured, but the structure becomes complex with multiple moving parts
Solution Approach 1:
The force frame is merged with the heat sink assembly into a single integrated structure. The lever mechanism is simplified to a single-point attachment that simultaneously provides both positioning and clamping functions, reducing the number of separate components and moving parts while maintaining clamping position stability.
4Ease of operation
If a tab is laterally offset from the hinge connecting the holding member to the stiffener, then the holding member can be pivoted, but torques are introduced during pivoting which impact positioning accuracy
Solution Approach 1:
The movement tab is positioned asymmetrically at the center of the rail frame, offset from the pivot point. This asymmetric positioning allows for easy manual operation while the central location ensures that the applied force creates minimal torque around the pivot axis, thereby maintaining positioning accuracy during the pivoting operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures accurate land-to-contact positioning, reduces torque during assembly, and facilitates efficient thermal contact between the integrated circuit and the heat sink, enhancing electrical and thermal performance.
Implementation Method 1
a rail frame having a first end pivotally coupled to the first end of the stiffener frame
Implementation Method 2
a force frame having a first end pivotally coupled to the first end of the stiffener frame and being operable to apply force to the packaged integrated circuit
Implementation Method 3
an insulating housing adapted to be mounted on the circuit board and positioned in the stiffener frame, the insulating housing including plural electrical contacts to electrically interface with the packaged integrated circuit
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Various apparatus and methods of electrically connecting a packaged integrated circuit (30) to a circuit board (20) are disclosed. In one aspect, an apparatus (10) includes a first frame (40) to be mounted on the circuit board (20) and having a first end. An insulating housing (60) is adapted to be mounted on the circuit board and positioned in the first frame. A second frame (80) is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members (760, 770) and a cross member (810) coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit (30). The second frame has at least one engagement member (862) to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame (90) is pivotally coupled to the first frame to apply force to the packaged integrated circuit.