PCB Bridge Cavity Connection via Conductive Particles
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Solution Overview
Problem
The increasing data processing demands due to AI technology advancements require more complex and reliable chip connections and signal pathways on printed circuit boards, which existing technologies struggle to simplify and diversify effectively.
Innovation Solution
A printed circuit board design featuring a first insulating layer with a connection via and cavity, a bridge with a bridge pad, and a bonding layer with conductive particles, allowing for diversified and simplified signal path implementations and improved reliability through anisotropic conductive connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional chip connection methods are used on printed circuit boards, then existing technology is simpler to implement, but it cannot effectively handle the increasing data processing demands and signal pathway complexity required by AI technology
Solution Approach 1:
The connection structure is divided into multiple functional components: connection vias penetrating the insulating layer, bridges disposed in cavities with bridge pads, and bonding layers with conductive particles. This segmentation allows each component to perform a specific function, enabling complex signal pathways while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The patent introduces three-dimensional connection structures including vertical vias penetrating through insulating layers, bridges extending in multiple directions within cavities, and conductive particles forming bonding layers. This dimensional transition from planar to spatial connections enables diversified signal paths that can handle increased data processing demands without proportionally increasing overall device complexity.
2Adaptability or versatility
If more complex chip connections are implemented to handle increased data processing demands, then signal pathway capability is improved, but the implementation becomes less simple and more difficult
Solution Approach 1:
The connection vias are formed penetrating through the insulating layer before the bridges are disposed in the cavities, and bonding layers are applied subsequently. This preliminary formation of the via structure establishes a ready-made framework that guides subsequent manufacturing steps, making the overall complex connection process more manageable and easier to manufacture.
Solution Approach 2:
The bonding layer with conductive particles acts as an intermediary between the connection vias and the bridges. This intermediate layer simplifies the manufacturing process by providing a standardized interface for connecting different components, reducing the complexity of directly joining vias to bridges, and enabling more straightforward implementation of complex signal pathways.
3Reliability
If conventional connection structures are used, then manufacturing is simpler, but reliability of chip connections is insufficient for improved data processing
Solution Approach 1:
The connection structure combines multiple materials with complementary properties: insulating layers provide electrical isolation, conductive materials in vias provide signal transmission paths, bridges offer mechanical support and additional conduction pathways, and bonding layers with conductive particles ensure reliable electrical and mechanical connections. This composite material approach enhances connection reliability through material diversity while managing overall structural complexity.
Solution Approach 2:
The cavity structure surrounding the bridges provides protective spacing and mechanical cushioning for the connection elements. This pre-designed protective structure shields the delicate conductive connections from mechanical stress and environmental factors, enhancing reliability without requiring overly complex protective mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables more efficient and reliable signal path connections, enhancing the board's ability to handle complex chip configurations and improve data processing capabilities.
Implementation Method 1
a bonding layer including conductive particles connected to the connection via and the first bridge pad
Data Source
AI summary
A printed circuit board includes a first insulating layer; a connection via penetrating through at least a portion of the first insulating layer and having an upper surface exposed to an upper surface of the first insulating layer; a cavity penetrating through at least a portion of the first insulating layer and having the upper surface of the first insulating layer as a bottom surface of the cavity; a bridge disposed in the cavity and having a first bridge pad disposed on a lower side of the bridge; and a bonding layer including conductive particles connected to the connection via and the first bridge pad.