Wiring Substrate Via Separation for Narrow Pitch

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Solution Overview

Problem

The narrow mounting pitch of connection terminals on semiconductor devices poses challenges in miniaturization due to the requirement for connection terminal widths to be larger than via diameters, making it difficult to achieve a narrow pitch without risking short circuits and voids in the underfill resin.

Innovation Solution

A wiring substrate design where the via is separated from the connection terminal, and a wiring pattern is used to electrically connect them, allowing the connection terminal width to be smaller than the via diameter, enabling a narrower pitch without short circuits or voids.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the connection terminal width is made larger than the via diameter to prevent short circuits, then the reliability is improved, but the mounting pitch cannot be narrowed

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmounting pitch

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent divides the electrical connection path into separate segments: the connection terminal, the via, and the wiring pattern. By separating the via from the connection terminal and introducing an independent wiring pattern, the design allows the connection terminal width to be reduced below the via diameter while maintaining reliable electrical connection through the segmented path.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The wiring pattern acts as an intermediary element that bridges the connection terminal and the via. This intermediary allows the via to be positioned separately from the connection terminal, enabling the connection terminal width to be smaller than the via diameter while still achieving electrical connection through the mediating wiring pattern.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the connection terminal width is reduced to narrow the mounting pitch, then the productivity is improved, but solder leakage and short circuits occur

Engineering Contradiction:

Improvemounting pitch reductionVSAvoidshort circuit prevention

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The wiring pattern serves as an intermediary that allows the via to be positioned away from the connection terminal. This separation enables the connection terminal width to be reduced for narrower mounting pitch while the wiring pattern ensures reliable electrical connection and prevents solder leakage by providing a controlled path between the terminal and via.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the via diameter is made larger to ensure electrical connection, then the electrical conductivity is improved, but the mounting pitch cannot be narrowed

Engineering Contradiction:

Improveelectrical connectionVSAvoidmounting pitch

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent segments the electrical connection path into distinct components (connection terminal, wiring pattern, via) that can be independently optimized. This allows the via diameter to be sized for optimal electrical connection while the connection terminal width and spacing are independently controlled to achieve narrow mounting pitch through the intervening wiring pattern.

Inventive Principle:

Principle #1Segmentation

4Manufacturing precision

If the connection terminal width is reduced to prevent voids in underfill resin, then the manufacturing precision is improved, but the electrical connection reliability deteriorates

Engineering Contradiction:

Improvevoid preventionVSAvoidelectrical connection

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The wiring pattern acts as an intermediary that decouples the connection terminal from the via, allowing the connection terminal width to be reduced for better underfill resin flow and void prevention. The wiring pattern maintains electrical connection reliability by providing a dedicated conductive path between the reduced-size terminal and the via.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS7943863B2Wiring substrate and manufacturing method thereof, and semiconductor device

Publication Date: 2011.05.17 SHINKO ELECTRIC IND CO LTD

AI summary

A wiring substrate includes a first insulation layer, a connection terminal, a second insulation layer, a via, and a wiring pattern. The connection terminal is disposed in the first insulation layer so as to be exposed from a first main surface of the first insulation layer, and is electrically connected with a semiconductor chip. The second insulation layer is disposed on a second main surface of the first insulation layer situated on the opposite side from the first main surface. The via is disposed in the second insulation layer, and is electrically connected with the connection terminal. The via is separated from the connection terminal. The wiring pattern is disposed on the second main surface of the first insulation layer and electrically connects the connection terminal and the via.