Multilayer Substrate Asymmetric Conductor Layers Prevent Delamination
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Solution Overview
Problem
Flexible substrates with microstripline structures are prone to delamination when subjected to external forces or temperature changes due to the interface between dielectric sheets.
Innovation Solution
A multilayer substrate design with insulating layers and conductor layers, where the second conductor layer covers a significant portion of the lower surface of the insulating sheet, and the thickness of the first insulating layer is smaller than the second, reducing the force applied at the interface and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate with microstripline structure is used, then the substrate can be made flexible and compact, but delamination occurs at the dielectric sheet interface when subjected to external forces or temperature changes
Solution Approach 1:
The patent applies local quality by creating an asymmetric conductor layer configuration where the area ratio of conductor layers differs on opposite sides of the dielectric sheet. Specifically, one conductor layer has a larger area ratio than the other, which locally compensates for stress imbalances at the dielectric interface, thereby preventing delamination while preserving flexibility.
Solution Approach 2:
The patent changes the geometric parameters of the conductor layers by controlling their area ratios relative to the dielectric sheet surfaces. By adjusting these area ratios to be asymmetric (one larger than the other), the patent modifies the stress distribution parameters at the dielectric interface, effectively preventing delamination under external forces or temperature variations.
2Reliability
If conductor layers are added to create a microstripline structure, then signal transmission capability is improved, but the complexity of the substrate structure increases
Solution Approach 1:
The conductor layers in the patent serve multiple functions simultaneously: they provide signal transmission capability for microstripline operation and also act as stress compensation elements that prevent delamination at the dielectric interface. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in structural complexity.
3Adaptability or versatility
If the substrate is made thinner to improve flexibility, then adaptability is improved, but the substrate becomes more susceptible to delamination
Solution Approach 1:
The asymmetric conductor layer configuration creates localized stress compensation at the dielectric interface. By having one conductor layer with a larger area ratio than the other, the structure locally balances the stress distribution at the bonding interface, preventing delamination even when the overall substrate thickness is reduced to enhance flexibility.
Data Source
AI summary
A multilayer substrate includes an element assembly including stacked insulating layers and including at least a first insulating layer with a first principal surface and a second principal surface and a second insulating layer with a third principal surface and a fourth principal surface, a first conductor layer, and a second conductor layer. The second principal surface and the third principal surface are in contact with each other, and no planar or linear conductors are located on the second principal surface and the third principal surface. The first conductor layer is located on the first principal surface, and the second conductor layer is located on the fourth principal surface.