Round Wire Bonding on Water-Soluble Adhesive Tape
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high cost and environmental hazards associated with print-and-etch processes for creating RF transponder wiring on flexible substrates, particularly due to the use of expensive chemicals and hazardous waste production, make these methods prohibitively expensive for some applications.
Innovation Solution
The use of round wire bonding on a water-soluble adhesive tape with cross wires and an RF transponder, where the antenna wire and cross wires form flat contact areas at intersections, allowing for stable wire bonding without the need for expensive print-and-etch processes, and utilizing automated wire bonding machines that can detect and bond these intersections effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If print-and-etch processes are used to create wiring patterns on flexible substrates, then wiring patterns can be formed, but the process becomes prohibitively expensive and produces hazardous waste
Solution Approach 1:
The patent extracts the wiring pattern creation process from the expensive print-and-etch methodology and replaces it with a simpler wire bonding approach. Round wires are directly bonded to the flexible substrate using adhesive and wire bonding techniques, eliminating the need for chemical etching processes while maintaining functional wiring patterns.
Solution Approach 2:
The patent employs inexpensive round wires and adhesive tapes as temporary or permanent wiring solutions on flexible substrates. These simple, low-cost components replace expensive etched conductive traces, achieving the same electrical connectivity function without requiring costly manufacturing processes or generating hazardous waste.
2Ease of manufacture
If round wire bonding is used instead of print-and-etch, then manufacturing cost decreases, but wire bonding stability and contact reliability become challenging
Solution Approach 1:
The patent applies adhesive tape to the flexible substrate before wire bonding, creating a pre-prepared surface that enhances wire bonding stability. The adhesive layer is applied in advance to ensure proper wire adhesion and positioning, making the subsequent wire bonding process more reliable and repeatable.
Solution Approach 2:
The patent uses a composite structure combining round wires with adhesive tape and flexible substrate. This composite approach integrates multiple materials (conductive wire, adhesive, flexible polymer) to achieve both mechanical stability and electrical connectivity, overcoming the limitations of using round wires alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the use of environmentally hazardous chemicals, produces strong and flexible RF transponder arrangements suitable for various applications, and minimizes obtrusiveness, with the ability to withstand millions of flexes and maintain a thin profile.
Implementation Method 1
an adhesive layer disposed on one surface of the water soluble backing. An antenna wire is adhered directly to the adhesive layer
Implementation Method 2
The antenna wire and cross wires are round wires having round cross sections, the first portion and the third portion have flat areas of contact
Data Source
AI summary
A disclosed circuit arrangement includes an adhesive layer on a water soluble backing, antenna wire adhered to the adhesive layer, an RF transponder disposed on the adhesive layer, and first and second cross wires attached to the adhesive layer and disposed proximate the RF transponder. The antenna wire has first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire. The first and second cross wires and the antenna wire have round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the RF transponder and to the first portion of the antenna wire, and a second bond wire is connected to the RF transponder and to the second portion of the antenna wire.