Wiring Base Plate Slit Design for Gas Release
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Solution Overview
Problem
In densely arranged electrode configurations on wiring boards, gas generated during solder joining can fill slits, obstructing gas flow and leading to voids within the joining material, which compromises the reliability and heat dissipation of electronic components.
Innovation Solution
The wiring board design incorporates electrodes with slits that have openings on the outer peripheral edge, oriented inward, allowing the central line of the slit to intersect with adjacent electrodes, facilitating effective gas release and reducing void formation by enabling gas to spread between adjacent electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a plurality of electrodes are densely arranged on the wiring board, then the electrode density and space utilization are improved, but gas flow obstruction increases and void formation occurs during solder joining
Solution Approach 1:
The electrode surface is segmented into multiple regions by forming slits that divide the electrode into several parts. This segmentation creates multiple gas escape paths, allowing gas to flow through the electrode structure rather than being blocked by the dense electrode arrangement, thereby preventing void formation while maintaining high electrode density
Solution Approach 2:
The slit structure is specifically designed with varying widths and positions tailored to each electrode's location and function. The slit width is optimized based on the electrode size and gas generation characteristics, creating localized quality variations that enhance gas release efficiency at critical areas while maintaining overall electrode density
2Ease of operation
If slits are provided in electrodes to facilitate gas release, then gas flow is improved, but gas flow obstruction occurs when joining material fills the slits in densely arranged electrodes
Solution Approach 1:
The slit structure is designed to extend in multiple dimensions within the electrode, creating a three-dimensional gas release network. The slits are positioned and sized to allow gas to escape through multiple pathways and directions, preventing the joining material from completely blocking gas flow while maintaining effective gas release
Solution Approach 2:
The electrode structure with integrated slits creates a porous-like configuration that allows gas to pass through multiple channels. This porous structure prevents gas flow obstruction by providing alternative pathways when some slits are filled with joining material, ensuring continuous gas release during the soldering process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures good gas release to the outside, minimizing voids within the joining material and enhancing the joining reliability and heat dissipation properties of electronic components, particularly in densely mounted light emitting devices.
Implementation Method 1
gas generated when joining using a joining material such as solder will fill the slits obstructing gas flow, so the gas will not be sufficiently released to the outside
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A wiring board (1) has an insulation base plate (11), and a plurality of electrodes (12) provided adjacent to each other in plan view on the insulation base plate (11), the electrodes (12) have an opening (12b) in the outer periphery and a slit (12a) oriented from the outer periphery to the interior, and, among two electrodes (12) adjacent to each other, the slit (12a) in one electrode (12) has a central line (12c) intersecting the outer periphery of the other electrode (12).