Circuit Board Support Structure Prevents Solder Short Circuits
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Solution Overview
Problem
In liquid crystal display technology, the use of printed circuit boards (PCBs) leads to issues such as short circuits during soldering, increased product manufacturing cycles due to different material and manufacturing sources for substrates, thicker displays, and low integration levels causing high circuit impedance and slow operation.
Innovation Solution
A circuit board design featuring a base substrate with bonding pads and supports allows for secure soldering of circuit modules, using a common material for substrates and modules to reduce thickness, increase integration, and prevent short circuits, with a manufacturing method that integrates circuit modules on a single base substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circuit modules are disposed on separate PCBs, then each module can be independently manufactured, but the space occupied by circuit modules increases and integration level decreases
Solution Approach 1:
The patent merges multiple circuit modules (power module, system module, timing control module) onto a single base substrate, eliminating the need for separate PCBs. This integration reduces the overall space occupied by circuit modules while maintaining independent manufacturability through modular design on the same substrate.
Solution Approach 2:
The base substrate serves multiple functions: it acts as the mounting platform for all circuit modules, provides electrical connections through bonding pads, and integrates signal routing for all modules. This multi-functional substrate reduces the need for separate PCBs while maintaining manufacturing flexibility.
2Strength
If PCB is used as carrier for circuit modules, then circuit modules can be securely mounted, but the thickness of display apparatus increases
Solution Approach 1:
The patent replaces traditional thick PCB carriers with a thin base substrate that securely mounts circuit modules. The base substrate provides sufficient mechanical strength for module mounting while being significantly thinner than conventional PCBs, thereby reducing the overall display apparatus thickness.
3Adaptability or versatility
If different materials are used for base substrate and carrier, then each can be optimized for its specific function, but manufacturing cycle increases due to different manufacturers
Solution Approach 1:
The patent uses the same material for both the base substrate and carrier, eliminating the need for separate manufacturing processes and assembly steps. This homogeneous material approach allows single-manufacturer production, significantly reducing the manufacturing cycle while maintaining functional optimization through proper material selection.
4Adaptability or versatility
If circuit modules have many pins, then more connections can be made, but short circuit risk increases during soldering
Solution Approach 1:
The patent introduces bonding pads as intermediary connection elements between circuit module pins and the base substrate. These bonding pads distribute the soldering process across multiple isolated contact points, reducing the risk of short circuits during soldering while maintaining the ability to make multiple connections. The bonding pads act as intermediate connection structures that improve soldering reliability.
Data Source
AI summary
The embodiments of present invention disclose a circuit board and a manufacturing method thereof and a display apparatus comprising the circuit board. The circuit board comprises a base substrate, a device to be soldered, a bonding pad and a support, wherein the bonding pad and the support are provided on the base substrate, and the device to be soldered is provided on the support and is connected with the bonding pad. By providing the device to be soldered on the support, the embodiments of present invention can effectively prevent the short circuit of the device to be soldered during the process of soldering and thus improve product yield.