Segmented Wire Bonding Head for Inclined Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wire bonding methods are inadequate for establishing reliable electrical connections between circuit boards with different inclinations and height levels, often resulting in non-uniform wire taper and increased risk of wire breakage due to the need for mechanical adjustments and lateral displacement, which is costly and complex.
Innovation Solution
A wire bonding head with two differently inclined contact surfaces and a feed for the bonding wire, where the inclination of each surface matches the corresponding bonding surface, allowing for ultrasonic bonding without the need for mechanical adjustments, enabling secure connections between circuit boards with varying inclinations and height levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonding with a single contact surface is used, then the bonding process is simple, but reliable electrical connections cannot be established between circuit boards with different inclinations and height levels
Solution Approach 1:
The wire bonding head is segmented into multiple contact surfaces (at least two differently inclined contact surfaces) instead of a single contact surface. Each contact surface is designed with a specific inclination angle to match corresponding bonding surfaces on circuit boards, enabling the system to handle multiple inclination angles without mechanical adjustments.
Solution Approach 2:
The wire bonding head is designed with multi-functionality by incorporating multiple contact surfaces with different inclinations, allowing it to bond wires to circuit boards with various inclination angles using the same bonding head without requiring mechanical adjustments or lateral displacements.
2Adaptability or versatility
If mechanical adjustments and lateral displacement are used to accommodate different inclinations, then adaptability is improved, but device complexity and cost increase
Solution Approach 1:
The wire bonding head is segmented into multiple contact surfaces (at least two differently inclined contact surfaces) instead of a single contact surface. Each contact surface is designed with a specific inclination angle to match corresponding bonding surfaces on circuit boards, enabling the system to handle multiple inclination angles without mechanical adjustments.
Solution Approach 2:
The bonding head is designed with fixed differently inclined contact surfaces that provide adaptability to different inclinations without requiring dynamic mechanical adjustments during the bonding process, thereby reducing device complexity while maintaining versatility.
3Ease of manufacture
If conventional wire bonding is used on inclined surfaces, then the bonding process is simple, but wire taper becomes non-uniform and wire breakage increases
Solution Approach 1:
Each contact surface on the bonding head is designed with a specific inclination angle that matches the corresponding bonding surface on the circuit board. This local adaptation ensures that the wire taper remains uniform during bonding by maintaining proper alignment between the contact surface and bonding surface, preventing deformation and wire breakage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a cost-effective, reliable, and flexible method for establishing electrical connections between geometrically complex topologies, such as in automotive headlight applications, with improved process reliability and reduced cycle time by eliminating the need for mechanical adjustments and minimizing wire breakage.
Implementation Method 1
the bonding wire guided over the pressure surface is pressed against the contact surface of the circuit board and at the same time ultrasonic vibrations are generated in the bonding head, whereby the wire is connected to the contact surface at the atomic level
Data Source
Figure 1(a)~1(b)
Figure 1(c)~1(d)
Figure 2(a)~2(b)
AI summary
The invention relates to a wire-bonding method for establishing an electric connection between a first bond body (210) with a first bond surface (211) which is to be contacted, and a second bond body (220) having a second bond surface (221) which is to be contacted, the first and the second bond surfaces having different inclinations. Said method comprises the following steps: (a) a wire-bonding head (200) with two differently inclined pressing surfaces (201, 202) and a guiding element (207) for a bond wire (203) are provided, the inclination of the first pressing surface (201) corresponds essentially to the inclination of the first bond surface (211), and the inclination of the second pressing surface (202) corresponds essentially to the inclination of the second bond surface (221), (b) a first bond connection is established between the bond wire (203) and the first bond body (210), the wire (203) being connected to the first bond surface (211) by means of the first pressing surface (201) of the wire bonding head (200) by ultrasonic bonding, and (c) a second bond connection is established between the wire (203) and the second bond body (220), said wire (203) being connected to the second bond surface (221) by means of the second pressing surface (202) of the wire bonding head (200) by ultrasonic boding. The invention also relates to a wire bonding head (200) for carrying out said method.