Vertical Component Embedding in Multilayer Circuit Boards
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Solution Overview
Problem
The existing methods for embedding passive components in flexible circuit boards result in increased size and reduced flexibility due to the need for multiple cavities and larger component dimensions, limiting the design possibilities of light, thin, and small electronic products.
Innovation Solution
A method for manufacturing a module-embedded multilayer circuit board involves embedding components vertically within through openings in the circuit board, using dielectric layers and copper clad laminates to reduce the horizontal area occupied and enhance flexibility, allowing multiple components to be placed without increasing the board's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are embedded horizontally in cavities, then the circuit board can accommodate embedded components, but the horizontal size of the circuit board increases
Solution Approach 1:
The patent transitions from horizontal embedding to vertical embedding of passive components. Instead of placing components side-by-side in the horizontal plane, components are stacked vertically along the thickness direction of the circuit board, utilizing the third dimension (Z-axis) to reduce horizontal footprint.
Solution Approach 2:
The patent implements nested embedding where multiple passive components are arranged in a vertical stack within a single cavity. The components are positioned at different heights along the vertical axis, allowing multiple components to occupy the same horizontal space, similar to nested dolls.
2Quantity of substance
If multiple cavities are defined to embed many passive components, then more components can be accommodated, but the circuit board requires sufficient horizontal size which reduces flexibility
Solution Approach 1:
The patent uses vertical stacking to accommodate multiple components within a single cavity, eliminating the need for multiple horizontal cavities. This approach maintains component quantity while reducing the board's horizontal dimensions and preserving design flexibility.
Solution Approach 2:
The patent merges multiple component embedding locations into a single vertical stack within one cavity. Instead of distributing components across multiple separate cavities, all components are combined in a single vertical arrangement, reducing the total number of cavities needed.
3Reliability
If the width and length of embedded passive components are larger than their thickness, then the components can be properly formed, but the horizontal size of the circuit board increases
Solution Approach 1:
The patent reorients component placement from horizontal to vertical, allowing components with larger width and length dimensions to be stacked along the thickness direction. This utilizes the vertical dimension to accommodate component dimensions that would otherwise require excessive horizontal space.
Data Source
AI summary
A module-embedded multilayer circuit board includes an inner circuit board, component embedded module embedded in the through opening, a first outer circuit board, and a second outer circuit board. A through opening is defined in the inner circuit board. The component embedded module includes a top surface and side surfaces. The top surface has a length greater than that of the two side surfaces. Each component embedded module includes a component, upper circuit patterns formed on the top surface, and side circuit patterns formed on the side surface and exposed from the through opening. The first and the second outer circuit board are formed on the inner circuit board. One end of the side circuit patterns is electrically connected to the first and the second outer circuit board, the other end of the side circuit patterns is electrically connected to the component by the upper circuit patterns, respectively.