Bus Bar Prepreg Assembly Resin Leakage
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Solution Overview
Problem
The high manufacturing cost of circuit boards and electrical junction boxes due to the use of adhesives for attaching bus bars to heat dissipation members, which increases costs and poses risks of resin leakage.
Innovation Solution
Employing a semi-cured prepreg instead of adhesive for attaching the bus bar to the circuit board, with a sheet-like leakage prevention layer to suppress resin leakage and using the same prepreg for joining the insulating substrate and bus bar, reducing component types and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to attach bus bar to heat dissipation member, then bonding strength is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive adhesive with a cheaper alternative - a resin-impregnated sheet material that serves as both bonding agent and insulator. The resin-impregnated sheet is a cost-effective substitute that eliminates the need for separate adhesive application while providing sufficient bonding strength for the bus bar attachment.
Solution Approach 2:
The resin-impregnated sheet performs multiple functions simultaneously: it acts as a bonding agent to attach the bus bar, provides electrical insulation between the bus bar and heat dissipation member, and prevents resin leakage. This multi-functionality eliminates the need for separate adhesive and insulator components, reducing overall manufacturing cost.
2Ease of manufacture
If prepreg is used instead of adhesive, then manufacturing cost is reduced, but resin leakage occurs
Solution Approach 1:
The patent introduces a resin leakage prevention sheet as an intermediary layer between the resin-impregnated sheet and the bus bar. This intermediate layer acts as a barrier that prevents the resin from leaking outward while allowing the bonding function to occur. The prevention sheet is specifically designed to control resin flow during the bonding process.
Solution Approach 2:
The resin leakage prevention sheet is implemented as a thin film or sheet structure that conformally covers the bonding interface. This thin film approach provides effective resin containment without adding significant thickness or complexity to the overall assembly, maintaining cost-effectiveness while preventing leakage defects.
3Manufacturing precision
If resin leakage is suppressed by additional layers, then manufacturing quality is improved, but device complexity increases
Solution Approach 1:
The patent merges the bonding function and leakage prevention function into a single integrated structure. The resin-impregnated sheet and leakage prevention sheet are combined in a layered configuration that achieves both bonding and leakage suppression simultaneously. This integration avoids the need for separate, complex leakage control mechanisms while maintaining manufacturing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs by eliminating adhesive costs and preventing resin leakage, while ensuring effective assembly and functionality of the circuit board and electrical junction box.
Implementation Method 1
a first prepreg that is overlaid on the bus bar
Implementation Method 2
a sheet-like leakage prevention portion that is overlaid on the surface of the first prepreg and suppresses leakage of the first prepreg to the outside
Data Source
AI summary
A circuit board includes: a bus bar; a first prepreg that is overlaid on the bus bar; and a sheet-like leakage prevention portion that is overlaid on the surface of the first prepreg and suppresses leakage of the first prepreg to the outside.