Dual-Sided WiFi Module With Flexible Circuit Board
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current WiFi module designs face challenges in down-sizing and weight reduction due to limitations in signal terminal processing, making it difficult to apply double-sided mounting technologies effectively, especially on smartphone boards where space is limited.
Innovation Solution
The proposed electronic device module features a dual-sided configuration with flexible printed circuit boards and molded parts to integrate components on both sides of a board, allowing for efficient signal processing and space optimization, including a central device receiving part, flexible printed circuit boards, and conductive layers for shielding and grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If double-sided mounting technology is applied to down-size the WiFi module, then the module size is reduced, but molding and shielding cannot be performed on the bottom surface due to signal terminal processing limitations
Solution Approach 1:
The patent divides the module into two separate boards: a first board for mounting electronic components and a second board with a device receiving part that provides bottom surface access. This segmentation allows molding and shielding to be performed on the bottom surface of the first board without interfering with signal terminal processing, while still achieving down-sizing through compact integration.
Solution Approach 2:
The patent transitions from a single-board design to a multi-board three-dimensional structure. By stacking the first board with electronic components above the second board with the device receiving part, the design utilizes the vertical dimension to enable bottom surface molding and shielding while maintaining compact footprint and achieving down-sizing.
2Volume of moving object
If components are integrated into a single electronic component to down-size, then the module size is reduced, but the complexity of integration and signal terminal processing increases
Solution Approach 1:
Rather than integrating all components into a single complex component, the patent segments the design into multiple manageable boards and components. The first board holds electronic components, the second board provides the device receiving part, and flexible FPC boards handle interconnections. This segmentation reduces integration complexity while achieving down-sizing through compact arrangement.
Solution Approach 2:
The patent introduces flexible FPC boards as intermediary connection elements between the first board and second board. These FPCs simplify the signal terminal processing by providing flexible, pre-fabricated interconnection solutions rather than requiring complex direct integrations, thereby reducing overall system complexity while enabling compact design.
3Ease of operation
If a card type WiFi module is used for easy implementation, then ease of implementation is improved, but it cannot be applied to smartphones due to space constraints
Solution Approach 1:
The patent transitions from a horizontal card-type layout to a vertical stacked multi-board configuration. By utilizing the vertical dimension with the first board mounted above the second board, the design achieves compact footprint suitable for smartphones while maintaining ease of implementation through standardized mounting processes and modular assembly.
Solution Approach 2:
The patent employs flexible FPC boards as thin-film interconnection media between the rigid first and second boards. These flexible circuits provide easy implementation through standardized FPC manufacturing and assembly processes while enabling compact three-dimensional integration that fits smartphone space constraints.
Data Source
AI summary
An electronic device module includes: a first board having first surface and a second surface facing opposite directions; electronic devices mounted on the first and second surfaces, respectively; a second board bonded to the second surface and including a device receiving part in which a device, among the electronic devices, is received, wherein the device receiving part is formed by a central opening of the second board; a first flexible printed circuit board including a first end part and a second end part disposed on opposite ends of the first flexible printed circuit board, wherein the first flexible printed circuit board is more flexible than the first and second boards, and wherein the first end part is formed integrally with the second board, is electrically connected to one end of the second board, and extends outside the second board; and a connector mounted on the second end part.