Embedded Power Module Heat Dissipation and Testing

The invention segments the circuit board into multiple layers with dedicated heat dissipation pathways. The conductive lines are distributed across different layers (first conductive lines in signal layer, second conductive lines in ground layer) to create separate heat dissipation channels, allowing heat from power chips to be efficiently conducted away through multiple paths rather than a single congested pathway.

The invention employs composite material structures combining different conductive materials with varying thermal and electrical properties. The first and second conductive lines use different metal compositions or cross-sectional areas to optimize both electrical conductivity for power supply and thermal conductivity for heat dissipation, creating a multi-functional conductive system.

The invention implements preliminary testing actions by providing dedicated test conductive lines that are pre-configured to access specific functional regions of the power chip (power supply region, signal processing region, heat dissipation region). These test pathways are established during board fabrication, enabling individual chip testing to be performed before final assembly, thus identifying defects early without requiring device disassembly.

The invention introduces intermediary test conductive lines as mediators between the embedded power chip and external testing equipment. These dedicated test lines act as intermediaries that provide access to internal chip regions without disrupting the compact embedded structure, allowing testing signals to reach otherwise inaccessible areas of the power chip.