PCB Region Coupling via Plated-Through Holes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production of printed circuit boards comprising multiple regions with different materials and functions is costly and prone to warping due to varying thermal expansion coefficients and miniaturization challenges, leading to reliability issues and complex assembly processes.
Innovation Solution
A method involving a conductive layer connected via plated-through holes to integrate and reliably couple printed circuit board regions, ensuring adjacent arrangement and enabling simple electrical contacting, with optional insulation and complementary coupling elements for mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If printed circuit boards are assembled by coupling superimposed layers of different materials to meet different functional demands, then functional versatility is improved, but the printed circuit board becomes warped or distorted due to different thermal expansion coefficients, reducing service life and reliability
Solution Approach 1:
The patent changes the physical state and properties of materials by introducing a stress-relief layer with specific mechanical properties (different thermal expansion coefficient) between the functional layers and substrate. This parameter change in the intermediate layer compensates for thermal stress, preventing warping while maintaining functional versatility of multiple material layers
Solution Approach 2:
The patent creates a composite structure by coupling superimposed layers of different materials (functional layers, stress-relief layers, substrate) to achieve both functional versatility and dimensional stability. The composite design allows each layer to contribute its specific properties while the overall structure remains stable
2Adaptability or versatility
If printed circuit boards are assembled by coupling superimposed layers of different materials, then functional versatility is improved, but the assembly process becomes complex and costly
Solution Approach 1:
The patent segments the printed circuit board into distinct functional layers and stress-relief layers, each with specific functions. This segmentation allows for standardized manufacturing of individual layers that can be assembled through simple coupling processes, reducing overall assembly complexity while maintaining functional versatility
Solution Approach 2:
The stress-relief layer acts as an intermediary between functional layers and substrate, simplifying the assembly process by providing a standardized interface that accommodates thermal expansion differences. This intermediary layer eliminates the need for complex adjustment mechanisms during assembly
3Area of moving object
If miniaturization is pursued in printed circuit boards, then space efficiency is improved, but production techniques become difficult to combine and assembly becomes more difficult
Solution Approach 1:
The patent implements a nested layer structure where functional layers, stress-relief layers, and substrate are stacked and coupled together. This nesting approach allows miniaturization by vertically integrating multiple functions in a compact space while maintaining standardized manufacturing processes for each layer type
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the production and assembly of printed circuit boards with diverse regions, enhancing mechanical and electrical reliability, reducing costs, and allowing for precise positioning and efficient use of materials, particularly in rigid-flexible circuit boards.
Implementation Method 1
the additional layer is embodied as a conductive layer which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions
Data Source
AI summary
In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.