Ceramic Substrate Edge Shielding via Metal-Coated Vias
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Solution Overview
Problem
Existing shielding structures for electronic device substrates are ineffective in blocking electromagnetic interference, consume excess volume, and are difficult to manufacture.
Innovation Solution
A ceramic substrate with a rectangular central opening and ring-shaped ceramic member, featuring metal-coated notches or rows of vias for edge shielding, and a foldable tab on the printed circuit to cover exposed metal traces, providing comprehensive electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal shielding cans are used to shield substrates, then electromagnetic interference is blocked, but device volume increases
Solution Approach 1:
The shielding structure is segmented into multiple components: metal traces on the substrate, folded tabs on the flexible printed circuit, and metal-coated notches or vias. These segmented elements work together to provide comprehensive shielding without requiring a single large shielding can, thus reducing overall device volume while maintaining EMI blocking effectiveness.
Solution Approach 2:
The shielding structure is nested within the existing substrate and circuit board layers. The metal traces are embedded in the substrate, the folded tabs are integrated into the flexible printed circuit assembly, and the metal-coated features are formed during substrate manufacturing. This nesting approach provides shielding functionality without adding external volume.
2Object-affected harmful factors
If traditional shielding structures are used, then electromagnetic interference is blocked, but manufacturing complexity increases
Solution Approach 1:
The shielding functionality is merged with existing manufacturing processes: metal traces are deposited during substrate fabrication, folded tabs are created through standard flexible circuit manufacturing, and metal-coated notches or vias are formed during substrate processing. This integration eliminates the need for separate shielding component manufacturing and assembly, simplifying the overall manufacturing process.
Solution Approach 2:
The substrate and flexible printed circuit themselves provide the shielding functionality through their own structures (metal traces, folded tabs, metal-coated features) rather than requiring external shielding components. The existing manufacturing processes for these components simultaneously create both the functional elements and the shielding structure, making the system self-shielding.
3Object-affected harmful factors
If shielding structures are added to substrates, then electromagnetic interference is blocked, but device reliability decreases
Solution Approach 1:
The shielding structure uses homogeneous materials and processes throughout: metal traces and metal-coated features use the same conductive materials, the folded tabs use the same flexible circuit material, and all components are manufactured using compatible processes. This homogeneity ensures consistent electrical properties and reliable performance across the entire shielding structure.
Solution Approach 2:
The shielding structure employs composite construction combining ceramic substrate material with metal traces, flexible circuit material with folded tabs, and metal coatings on substrate features. These composite structures provide both the mechanical integrity needed for reliability and the electrical conductivity required for effective EMI shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference, optimizes device volume, and simplifies manufacturing by using metal-coated notches, vias, and foldable tabs to shield the substrate edges, enhancing the reliability and efficiency of electromagnetic interference suppression.
Implementation Method 1
electromagnetic interference shielding may be formed from a metal-coated notch or a row of metal-coated vias
Implementation Method 2
A folded tab of the printed circuit may form a shield that covers these exposed traces
Data Source
AI summary
An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.