3D Patterned Module Surface for Compact Electronics Cooling
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Solution Overview
Problem
Modern electronic devices face challenges in heat dissipation due to increased component density and smaller module sizes, which can lead to overheating and reduced performance.
Innovation Solution
A three-dimensional (3D) patterned module exterior surface is used to increase heat dissipation, achieved by forming a 3D pattern in the exterior surface of the overmold and optionally in the protective shield, thereby enhancing the surface area for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If module size is reduced to increase component density, then more circuit components can be fitted into smaller volume, but surface area for heat dissipation is reduced
Solution Approach 1:
The patent transforms the flat two-dimensional exterior surface into a three-dimensional patterned surface with protrusions and recesses. This dimensional transformation increases the effective surface area available for heat dissipation without increasing the overall module footprint, thereby resolving the contradiction between compact size and heat dissipation capability.
Solution Approach 2:
The 3D pattern creates a nested structure where the overmold contains circuit components within its interior cavity while the exterior surface provides additional heat dissipation area. This nested arrangement allows the heat dissipation surface to extend beyond the simple boundary of the module envelope.
2Adaptability or versatility
If more power amplifiers are added for EN-DC applications, then communication functionality is enhanced, but heat generation in the module increases
Solution Approach 1:
The patent converts the harmful effect of increased heat generation from additional power amplifiers into a manageable thermal challenge by providing enhanced heat dissipation pathways. The 3D patterned surface transforms the thermal problem into an opportunity for improved thermal management, allowing the module to support more power amplifiers without compromising reliability.
3Volume of moving object
If dies are located closer together to reduce module size, then module compactness is improved, but heat density increases leading to overheating
Solution Approach 1:
The patent applies local quality enhancement by creating regions of increased surface area (protrusions) in specific locations on the module exterior. These localized 3D features concentrate heat dissipation capability in areas that correspond to high-heat-density regions, allowing compact die placement while managing thermal hotspots through locally enhanced heat transfer surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased surface area due to the 3D pattern effectively improves heat dissipation, managing internal temperatures and enhancing the performance and lifespan of electronic devices.
Implementation Method 1
a three-dimensional (3D) pattern is formed in the exterior surface of the overmold to increase the surface area and, therefore, increase a rate of heat dissipation from the module
Implementation Method 2
Much of the heat generated within a module is conducted through an overmold disposed on the circuit components
Data Source
AI summary
A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.