Printed Circuit Assembling TRIZ Cases

Printed coil patterns on both sides of a flexible PCB replace complex winding, enabling uniform turns and lower-cost Rogowski coil production.

Dual springs in a compliant pin absorb shock and constrain PCB movement, reducing wear and intermittent electrical contact.

Electrostatic chuck transfer holds tiny conductive balls in mask grooves, then releases them onto a substrate without misses or mask deformation.

A 3D overmold or shield surface adds heat-dissipation area, helping dense electronic modules run cooler without increasing size.

Phase change materials and slot-based thermal paths help embedded components shed heat while keeping the circuit board thin.

Layered conductive particles and magnetic spacing reduce shorts and opens in display pad bonding while preserving electrode connectivity.

A segmented heat spreader and stiffener layout reduces CTE mismatch stress while maintaining heat conduction in multi-chip PCB assemblies.

A joint machine links wire ends from multiple spools to keep capillary feed continuous and avoid manual spool exchange delays.

Different pad heights in the final build-up layer keep solder ball pitch uniform while aligning chips of different thicknesses.

A heat radiator and edge fixing assembly press a lidless packaged chip evenly into a slot to improve cooling and terminal contact reliability.

A cushioned embedded PCB structure uses segmented adhesive and an integrated antenna layer to protect components, improve cooling, and maintain signal transmission.

A pocketed substrate with a bridge chiplet boosts chip-to-chip interconnect density while preserving through-board routing and lowering package complexity.

Independent PCB conduction paths balance parallel GaN switching legs to cut parasitic inductance, overshoot, and current oscillation.

A 3D fan-out package uses redistribution layers and PCB support to shrink IC structures while improving mounting strength and reliability.

Vertical stacking uses a lead frame to connect and cool the light emitting module, cutting packaging footprint while supporting miniaturization.

Magnetic deposits let components attach and detach from a multilayer PCB, cutting substrate manufacturing cost while enabling reuse.

Conductive warp and weft fiber connections embed components in fabric while isolating signal paths to prevent dislodgement and short circuits.

Asymmetric protrusions and heat-sink recesses key each power module to the correct circuit position, preventing mounting errors on a shared control substrate.

A stacked mother-daughter board with side wiring shifts the second wiring layer outward to avoid wire scratching and reduce level differences.

A monolithic surface-mount transmission line capacitor replaces wire bonds to tailor 20-60 GHz response while keeping insertion loss above -1.0 dB.

Wire bond vias overcome etching limits on aspect ratio and pitch, enabling denser package stacking with protected bases and exposed contact tips.

Direct pin-fins built into high-power PCBs remove TIM and coldplate layers, improving heat transfer and avoiding interface dry-out.

A copper PCB insert replaces pin limits by carrying heat and current through a sintered joint, with a secondary path for limp-home operation.

Segmented connection film with non-pasting zones mounts multi-row terminals on concave surfaces using existing equipment while avoiding gas trapping.

Offset lead tabs and top-bottom terminals shorten ground paths, cutting inductance while preserving a smaller PCB footprint.

Corner pins support semiconductor packages during PCB reflow, preventing collapse, solder bridging, and short-circuit risk.

A capacitor placed between stacked PCBs replaces pillars and vias, cutting parasitic inductance, resonance, and component stress.

Terminal holes, metallized surfaces, and solder or press-fit contacts create reliable external connections without sacrificing insulation or support.

A cantilevered spring and shunting lever shorten the signal path in dense LGA sockets to cut crosstalk and improve single-ended signal integrity.

A layered bridge interconnect uses vias, a barrier layer, and solderable material to enable finer pitch while limiting copper diffusion and electromigration.

Embedded capacitor connections and an insulating heat-conducting plate reduce loop inductance while maintaining heat dissipation in GaN and SiC modules.

Larger metal grains and smoother mesh wiring cut high-frequency transmission loss while preserving transparency and radio wave sensitivity.

A foldable cell matrix with visco-elastic cushioning boosts wearable battery capacity while limiting weight, shock damage, and liquid ingress.

A shaped, high-contrast housing feature helps optical sensors reliably detect dark PCB connectors for precise automated placement.

Automatic optical inspection and laser repair fill empty or defective pickup sites before mass transfer, raising electronic component yield.

A detachable gold finger outlet connection replaces wire welding to simplify fan frame assembly, testing, and circuit board heat dissipation.

A PCB-mounted wire guide threads thin coil leads into solder contacts, making electrohydraulic actuator assembly more reliable and easier to automate.

A separation component supports symmetric lamination of thin-core carriers, reducing warpage while improving die embedding and heat dissipation.

A thin substrate and insulator layer replace cover film to protect the IC, keep the module flat, and improve handling during mounting.

Different land electrode heights balance plating buildup and suppress tilt and conduction defects in ceramic substrate mounting.

A low-profile bottom-side cable connector delivers high voltage through the regulator, freeing PCB top space and enabling easier cable replacement.

Small driver ICs inside each LED package cut flexible display thickness, simplify FPCB assembly, and spread heat for better image control.

A ceramic dielectric with top and bottom ground paths cuts thermal resistance in RF PCB parts, improving heat dissipation and power handling.

Directly attaching coaxial wires to BGA solder balls uses a fixation element and conductive bridge to keep alignment stable and prevent shorts.

A thermally conductive insulating substrate and heat-sink terminal let compact thin-film RF components handle higher power with stable 5G-frequency behavior.

Using a higher-melting solder ball than the component-mount solder prevents remelt deformation and preserves board mountability and bondability.

Flat portions on solder particles increase electrode contact and wetting, improving conduction and insulation reliability in miniaturized anisotropic materials.

Thin-film functional layers with built-in feedthroughs replace soldering and wire bonding for compact, reliable MEMS or SESUB integration.

Via-based strap contacts move traces and components to one PCB side, cutting copper etching, material waste, and battery pack assembly time.

An integrated filter directly receives and mixes diverging light from multiple wavelength sources, eliminating bulky lenses to reduce module volume.

Back drilling removes via stubs to create a conductive ring structure for electrical testing.

Three-dimensional dielectric wires reduce layer density by enabling flexible routing between parallel circuit planes.

Prepared recessed windows resolve height mismatch and integration time trade-offs by enabling wafer-level flip-chip assembly.

Segmenting manufacturing into modular unit cells enables flexible material selection and custom circuit topologies without expensive photolithography.

Spherical conductive members in substrate holes bond electrodes, eliminating plating steps and reducing manufacturing costs.

A shoulder-equipped alignment plate restrains circuit board movement against a stiffener frame, ensuring uniform adhesive bonding and reducing warpage.

Positioning members separate conductors to prevent short-circuits while ensuring reliable surface-mount bonding.

Silver sintering joins substrates and lead frames in a balanced stress assembly, reducing substrate warping while maintaining high electrical conductivity.