Component Carrier Separation Structure for Thin-Core Die Embedding
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Solution Overview
Problem
Existing methods for manufacturing component carriers face challenges in embedding electronic components efficiently, particularly with large dies, due to warpage issues and inadequate thermal management, especially in thin core structures which are prone to yield drops and heat dissipation problems.
Innovation Solution
The method involves using a separation component sandwiched between two preforms of component carriers to stabilize the structure during manufacturing, allowing for symmetrical lamination and efficient heat dissipation by embedding the electronic component between a low Young modulus layer and a redistribution structure, which connects small electric contacts to larger ones on the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thin core structure is used in component carriers, then space requirements are reduced and manufacturing efficiency is improved, but warpage issues occur especially when large dies are embedded and yield drops increase
Solution Approach 1:
The patent applies preliminary action by performing lamination on both sides of the core structure simultaneously before embedding the electronic component. This pre-lamination stabilizes the thin core structure, preventing warpage during subsequent processing steps and maintaining manufacturing yield despite the reduced core thickness.
Solution Approach 2:
The patent introduces asymmetry by embedding the electronic component offset from the center of the core structure. This offset positioning creates an asymmetric weight distribution that counteracts the warpage tendency, allowing the thin core structure to maintain flatness and reliability during manufacturing.
2Reliability
If a thick core structure is used to avoid warpage, then manufacturing reliability is improved, but heat dissipation becomes problematic due to increased thermal resistance
Solution Approach 1:
The patent positions the electronic component offset from the center of the core structure, creating an asymmetric configuration. This offset positioning enables the heat sink to be placed closer to the component, improving thermal coupling and heat dissipation efficiency while maintaining manufacturing stability through the lamination process.
Solution Approach 2:
The patent applies local quality by concentrating thermal management resources where needed - placing the heat sink in close proximity to the electronic component rather than distributing it uniformly throughout the core. This localized approach improves heat dissipation efficiency without requiring increased core thickness.
3Adaptability or versatility
If electronic components are embedded in component carriers, then functionality is enhanced, but efficient electrical connection and thermal management remain challenging
Solution Approach 1:
The patent merges multiple functions into the offset embedding configuration: the asymmetric positioning simultaneously achieves mechanical stability (preventing warpage), facilitates thermal management (closer heat sink placement), and enables electrical connection. This single design decision addresses multiple challenges that would otherwise require separate solutions.
Solution Approach 2:
The offset embedding configuration serves multiple purposes: it stabilizes the thin core structure against warpage, improves heat dissipation by enabling closer heat sink placement, and maintains electrical connectivity. This multi-functional approach simplifies the overall device design while enhancing functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables robust and flexible embedding of electronic components with improved heat dissipation in thin component carriers, reducing warpage and increasing process speed, while maintaining mechanical and electrical reliability.
Implementation Method 1
at least one electrically insulating layer structure is a low Young modulus layer structure formed of a low Young modulus material
Implementation Method 2
an electronic component embedded in a cavity of the layer stack and electrically connected with the redistribution structure such that a first electric contact of the electronic component is transferred via the redistribution structure to a second electric contact at a main surface of the layer stack
Implementation Method 3
Removal of heat generated by such electronic components and the component carrier itself during operation becomes an increasing issue
Data Source
Figure 1a~1i
Figure 2a~2d
Figure 3a~3c
AI summary
A method of manufacturing a first component carrier (100a) and a second component carrier (100b), the method comprising: i) providing a separation component (150) comprising a first separation surface (151) and a second separation surface (152) being opposed to the first separation surface (151), ii) coupling a first base structure (110) having a first cavity (111) with the first separation surface (151), iii) coupling a second base structure (120) having a second cavity (121) with the second separation surface (152), iv) placing a first electronic component (115) in the first cavity (111), v) connecting the first base structure (110) with the first electronic component (115) to form the first component carrier (100a), vi) placing a second electronic component (125) in the second cavity (112), vii) connecting the second base structure (120) with the second electronic component (125) to form the second component carrier (100b), viii) separating the first component carrier (100a) from the first separation surface (151) of the separation component (150), and ix) separating the second component carrier (100b) from the second separation surface (152) of the separation component (150).