Embedded Circuit Board Thermal Path Using Phase Change Materials
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Solution Overview
Problem
Circuit boards with embedded electronic components face challenges in heat dissipation, as the heat generated by the components cannot effectively dissipate to the outside environment, leading to potential thermal issues.
Innovation Solution
The circuit board design incorporates a heat dissipation medium layer, a groove for the electronic component, and phase change materials to enhance thermal conductivity and dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the electronic component is embedded in the circuit substrate, then the overall height of the circuit board is reduced, but the heat generated by the electronic component cannot dissipate to the outside environment
Solution Approach 1:
The patent introduces a heat dissipation medium layer positioned between the circuit substrate and the electronic component, creating a new thermal management dimension. This layer provides thermal conduction pathways that extend vertically through the embedded structure, allowing heat to dissipate in the thickness direction while maintaining the low-profile embedded configuration.
Solution Approach 2:
The heat dissipation medium layer acts as an intermediary between the electronic component and the circuit substrate. This intermediate layer facilitates thermal energy transfer from the embedded component to the external environment, resolving the heat dissipation issue without requiring the component to be surface-mounted.
2Length of stationary object
If the electronic component is embedded in the circuit substrate, then the overall height of the circuit board is reduced, but heat dissipation pathways are blocked
Solution Approach 1:
The heat dissipation medium layer is specifically positioned in the local region between the electronic component and the circuit substrate, providing targeted thermal management. This localized approach improves heat dissipation efficiency at the component level without affecting the overall embedded structure or increasing the board height.
3Device complexity
If traditional embedding methods are used, then the circuit board structure is simple, but thermal management capabilities are insufficient
Solution Approach 1:
The heat dissipation medium layer is constructed from composite materials comprising a resin matrix and thermally conductive fillers. This composite structure provides both the mechanical properties needed for the embedded configuration and the thermal conductivity required for effective heat dissipation, thereby improving reliability without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the overall thickness of the circuit board, improves heat dissipation efficiency, and maintains the operational temperature of the electronic component, addressing the thermal challenges faced by traditional designs.
Implementation Method 1
a heat dissipation medium layer, a groove for the electronic component, and phase change materials to enhance thermal conductivity and dissipate heat efficiently
Implementation Method 2
phase change materials to enhance thermal conductivity and dissipate heat efficiently
Data Source
AI summary
A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.