Stacked Wiring Board Layout to Prevent Scratching and Step Height
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Solution Overview
Problem
Existing lighting and display technologies face challenges in manufacturing large-size products with high yield and low production costs, particularly due to issues like wire scratching and excessive level differences during the manufacturing process.
Innovation Solution
A wiring board design comprising a mother board and a daughter board stacked with a bonding layer in between, along with side wiring connections, which allows for the prevention of wire scratching and reduction of level differences by strategically placing the second wiring layer on the daughter board away from the mother board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the second wiring layer is disposed on the side of the second substrate proximate to the mother board, then the wiring board can achieve compact structure, but wire scratching occurs during manufacturing process
Solution Approach 1:
The patent moves the second wiring layer from the conventional position (proximate to the mother board) to the opposite side of the second substrate (away from the mother board). This dimensional repositioning in the thickness direction eliminates wire scratching issues while maintaining compact overall structure through the stacked mother board-daughter board configuration.
2Ease of manufacture
If the second wiring layer is disposed on the side of the second substrate proximate to the mother board, then the manufacturing process is simplified, but excessive level differences occur
Solution Approach 1:
By repositioning the second wiring layer to the opposite side of the second substrate, the patent resolves the level difference issue. The via structures penetrating through the second substrate enable electrical connection while the spatial separation eliminates excessive level differences, maintaining manufacturing precision.
3Reliability
If the second wiring layer is disposed on the side of the second substrate away from the mother board, then wire scratching is prevented and level differences are reduced, but the wiring board structure becomes more complex
Solution Approach 1:
The patent divides the wiring board into segmented components: mother board, daughter board, and second substrate, each with specific wiring layers. This segmentation allows the second wiring layer to be positioned on the opposite side of the second substrate, preventing wire scratching while managing structural complexity through modular design.
Solution Approach 2:
The patent employs a nested structure where the second substrate with its wiring layer is integrated within the daughter board, which itself is stacked with the mother board. This nesting approach accommodates the repositioned second wiring layer on the opposite side of the second substrate, preventing wire scratching while organizing the complex structure in a compact, hierarchical manner.
Data Source
AI summary
A wiring board includes a mother board and a daughter board that are stacked, a bonding layer disposed between the mother board and the daughter board, and at least one side wiring. The mother board includes a first substrate, and a first wiring layer disposed on the first substrate and including at least one first connection pad. The daughter board is disposed on a side of the first substrate away from the first wiring layer. The daughter board includes a second substrate, and a second wiring layer disposed on the second substrate and including at least one second connection pad. The at least one side wiring is connected, via a respective end thereof, to the at least one first connection pad in one-to-one correspondence, and the at least one side wiring is connected, via respective another end thereof, to the at least one second connection pad in one-to-one correspondence.