Flexible Display Pixel Packaging for Thin, Heat-Managed Panels
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Solution Overview
Problem
Existing flexible display apparatuses face challenges with increased product thickness, complex manufacturing processes, high costs, reduced image display performance due to large driver ICs, and heat concentration issues, primarily because components are mounted on both surfaces of the flexible printed circuit board (FPCB) and the driver IC controls multiple LEDs.
Innovation Solution
The solution involves individually mounting a driver integrated chip (IC) within each light-emitting device package to control red, green, and blue LED chips, simplifying the manufacturing process, reducing product thickness, and minimizing the driver IC size, while using a monolayer FPCB structure and a flexible protection member to manage heat and improve image display performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are mounted on both top and bottom surfaces of the FPCB, then the display apparatus can function with necessary components, but the total product thickness increases
Solution Approach 1:
The patent transitions from a planar mounting approach (top and bottom surfaces of FPCB) to a vertical stacking approach (multiple layers within each pixel unit). By arranging the driver IC, light-emitting devices, and wiring in stacked layers within each pixel, the design achieves functional completeness while minimizing the horizontal footprint and reducing overall product thickness.
Solution Approach 2:
The patent implements a nested structure where the driver IC and light-emitting devices are integrated within each pixel unit, which itself is arranged on the FPCB. This nested arrangement allows multiple functional components to be contained within compact pixel modules, reducing the need for separate component mounting areas on both sides of the FPCB.
2Ease of manufacture
If components are mounted on both surfaces of the FPCB, then the display apparatus can be assembled, but the manufacturing process becomes complicated
Solution Approach 1:
The patent divides the display apparatus into discrete pixel units, each containing a driver IC, light-emitting devices, and associated wiring. This segmentation allows for standardized manufacturing of individual pixel modules that can be systematically assembled, simplifying the overall manufacturing process compared to mounting individual components across both FPCB surfaces.
Solution Approach 2:
The patent combines the driver IC, light-emitting devices, and wiring into integrated pixel units. This merging of functions into unified modules reduces manufacturing complexity by eliminating the need for separate mounting and interconnection processes for individual components on both sides of the FPCB.
3Ease of manufacture
If a multilayer FPCB structure is used to accommodate components, then component mounting is enabled, but the product cost greatly increases
Solution Approach 1:
The patent employs a flexible FPCB with a simplified structure that accommodates the stacked pixel units through its flexibility rather than through complex multilayer construction. This approach uses the inherent properties of flexible circuits to achieve component integration without the high costs associated with multilayer FPCB manufacturing.
4Ease of operation
If a single driver IC controls a large number of LEDs, then the control function is achieved, but the driver IC size increases
Solution Approach 1:
The patent divides the control function into multiple small driver ICs, each responsible for controlling a limited number of light-emitting devices within its pixel unit. This segmentation of the control function reduces the size of each individual driver IC compared to a single large driver IC that would control all LEDs.
Solution Approach 2:
The patent assigns specific control functions to local driver ICs within each pixel unit, allowing each driver IC to be optimized for its specific control task. This local specialization enables smaller, more efficient driver ICs rather than requiring one large driver IC to handle all control functions.
5Device complexity
If a single driver IC controls many LEDs, then control is centralized, but individual LED control is reduced
Solution Approach 1:
The patent segments the control architecture into multiple independent driver ICs, each associated with specific light-emitting devices in its pixel unit. This segmentation enables individual control of LEDs while maintaining a manageable system architecture, as each driver IC handles only a small subset of LEDs rather than all LEDs centrally.
6Ease of operation
If the driver IC is large to control many LEDs, then control capability is sufficient, but heat generation becomes concentrated
Solution Approach 1:
The patent divides the control function across multiple small driver ICs distributed throughout the display apparatus, rather than using one large centralized driver IC. This segmentation distributes heat generation across multiple small components, preventing heat concentration and improving thermal management.
Solution Approach 2:
The patent places small driver ICs locally within each pixel unit, allowing heat to be generated in distributed locations rather than concentrated in a single area. This local distribution of driver ICs facilitates better heat dissipation and reduces thermal issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in an ultra-thin product thickness, simplified manufacturing, reduced costs, enhanced image display performance through individual LED control, and effective heat management by minimizing the driver IC size within each light-emitting device package.
Implementation Method 1
The light-emitting devices may include a red light-emitting diode (LED) chip, a green LED chip, and a blue LED chip
Data Source
AI summary
Provided is a flexible display apparatus capable of displaying images when mounted on pillars or curved objects or rolled up, and a method of manufacturing the flexible display apparatus, the flexible display apparatus including a flexible printed circuit board (FPCB) made of a ductile material so as to be freely bent, a wiring layer provided on the FPCB, and a plurality of light-emitting device packages arranged in M rows and N columns on the wiring layer so as to be electrically connected to the wiring layer, wherein each light-emitting device package includes a package substrate, one or more light-emitting devices provided on the package substrate, and a driving device for applying a control signal to the light-emitting devices.