Lidless Chip Module Assembly for Heat Dissipation and Stable Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Lidless packaged chips face challenges in heat dissipation and reliable connection to circuit boards due to poor surface flatness and uneven pressure distribution from heat radiators, leading to potential damage and reduced reliability.
Innovation Solution
A chip module design that includes a circuit board with a slot, a lidless packaged chip, a heat radiator, and a substrate fixing assembly, where the heat radiator presses the chip's middle area into the slot, and the substrate fixing assembly presses the chip's edge into the slot, ensuring even pressure and reliable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat radiator is press-fitted on the lidless packaged chip, then heat dissipation function is provided, but surface flatness is poor and pressure is unevenly distributed causing the heat radiator to be skewed
Solution Approach 1:
The patent introduces a lid with a local recessed cavity that matches the shape of the heat radiator. This local structural modification creates a dedicated mounting space for the heat radiator, ensuring proper fit and even pressure distribution without requiring the entire chip surface to be flat. The recessed cavity provides localized support exactly where needed.
Solution Approach 2:
The lid is segmented into a flat outer surface and an inner recessed cavity. This segmentation allows the lid to serve dual functions: maintaining overall surface flatness for structural integrity while providing a localized non-flat region for the heat radiator mounting. The heat radiator is thus isolated in its own structural niche.
2Temperature
If a heat radiator is press-fitted on the lidless packaged chip, then heat dissipation is attempted, but the heat radiator is prone to be skewed and the die may be crushed
Solution Approach 1:
The recessed cavity in the lid acts as a pre-prepared cushioning structure. By designing the cavity to exactly accommodate the heat radiator, the patent ensures that when the heat radiator is pressed onto the chip, the pressure is distributed evenly through the cavity walls rather than concentrating on specific points. This beforehand structural preparation prevents both skewing and die crushing.
Solution Approach 2:
The recessed cavity serves as an intermediary structure between the heat radiator and the chip die. Instead of the heat radiator directly contacting and potentially crushing the die, the cavity walls mediate the pressure distribution, providing a buffer that protects the die while still enabling effective heat transfer.
3Reliability
If solder ball connection is used between packaged chip and circuit board, then electrical connection is achieved, but materials have different expansion coefficients causing warp during soldering
Solution Approach 1:
The patent extracts the problematic solder ball connection and replaces it with a slot-based mechanical connection. By removing the solder balls and their associated thermal expansion issues, the patent eliminates the source of warping during soldering while maintaining electrical connection through the slot and elastic terminal structure.
4Temperature
If lidless packaged chip is used to improve heat dissipation, then heat dissipation capability is enhanced, but surface flatness is poor making connection unreliable
Solution Approach 1:
The lid maintains local quality by having a flat outer surface for structural support and connection reliability, while containing a local recessed cavity for heat radiator accommodation. This allows the lidless packaged chip to benefit from improved heat dissipation through the heat radiator while the flat lid surface ensures reliable mechanical and electrical connection to the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of the connection between the lidless packaged chip and the circuit board, improves heat dissipation efficiency, and increases the structural strength of the chip module.
Implementation Method 1
the heat radiator is press-fitted on one side of the die facing away from the circuit board, to press a middle part of the lidless packaged chip toward the slot
Implementation Method 2
the connecting part is inserted into the slot, so that the connecting part is connected to an elastic terminal in the slot
Implementation Method 3
the substrate fixing assembly is press-fitted at a periphery of one side of the substrate facing away from the circuit board, to press an edge of the lidless packaged chip toward the slot
Implementation Method 4
the heat radiator is press-fitted on one side of the die facing away from the circuit board... improve a heat dissipation effect
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
This application provides a chip module and an electronic device. The chip module includes a circuit board (2), a slot (21) disposed on a surface of one side of the circuit board (2), a lidless packaged chip (5), a heat radiator (4), and a substrate fixing assembly (6). The lidless packaged chip (5) includes a substrate (51) and a die (52) packaged on the substrate (51). The slot (21) is electrically connected to the circuit board (2), the lidless packaged chip (5) has a connecting part on one side of the substrate (51) facing away from the die (52), and the connecting part is inserted into the slot (21), so that the connecting part is connected to an elastic terminal (211) in the slot (21). The heat radiator (4) is press-fitted on one side of the die (52) facing away from the circuit board (2), to press a middle part of the lidless packaged chip (5) toward the slot (21), so that the connecting part at the middle part of the lidless packaged chip (5) is reliably connected to the elastic terminal (211) in the slot (21). The substrate fixing assembly (6) is press-fitted at a periphery of one side of the substrate (51) facing away from the circuit board (2) and avoids the die (52), to press an edge of the lidless packaged chip (5) toward the slot (21), so that the connecting part at the edge of the lidless packaged chip (5) is reliably connected to the elastic terminal (211) in the slot (21).