Direct BGA Wire Attachment With Fixed Coaxial Lead Alignment
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Solution Overview
Problem
Conventional Surface Mount Technology (SMT) techniques are inadequate for mounting electrical components with a ball-grid array (BGA) of solder balls to achieve a reliable and durable electrical connection to electrical power and data communication elements, especially in applications requiring a streamlined or compact design without the use of a printed circuit board.
Innovation Solution
An electrical device with a BGA component having solder balls spaced apart on a component mounting surface, directly electrically coupled to coaxial wires that pass through a wire fixation element, which includes an electrically-conductive bridge and a wire guide to secure and isolate the wires, allowing for a robust attachment without a printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If conventional SMT techniques are used to mount BGA components, then the component can be mounted on a printed circuit board, but the profile is not streamlined and the design is more complex
Solution Approach 1:
The patent extracts the BGA component directly from the printed circuit board mounting context and connects it wirelessly to the circuit board via wireless connectors, eliminating the need for traditional SMT mounting and achieving a streamlined profile while reducing design complexity
Solution Approach 2:
The patent introduces wireless connectors as intermediary elements that facilitate the electrical connection between the BGA component and the circuit board, replacing the traditional direct solder joint and enabling a more compact, streamlined design
2Shape
If alternative mounting methods are used to achieve streamlined profile, then the profile is improved, but the electrical connection reliability and durability are insufficient
Solution Approach 1:
The patent employs flexible wires that can dynamically accommodate thermal expansion and mechanical stress, maintaining reliable electrical connections while preserving the streamlined profile achieved by alternative mounting methods
Solution Approach 2:
The patent uses composite wireless connectors that combine conductive materials with flexible insulating materials, achieving both streamlined profile and reliable electrical connection through the synergistic properties of different materials
3Device complexity
If direct wire attachment is used without printed circuit board, then the design is streamlined, but achieving reliable and durable electrical connection is difficult
Solution Approach 1:
The patent applies preliminary protective coatings and pre-formed wireless connectors to the BGA component before final assembly, ensuring reliable and durable electrical connections are established in advance, simplifying the overall design while maintaining connection integrity
Solution Approach 2:
The patent modifies physical parameters such as wire gauge, connector geometry, and solder joint characteristics to optimize both the streamlined design and the durability of electrical connections in direct wire attachment configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and robust electrical connection between the BGA component and electrical wires, preventing short circuits and ensuring proper alignment and structural support, thus overcoming the limitations of conventional SMT techniques.
Implementation Method 1
a wire fixation element, through which the plurality of electrical wires at least partially pass through. The wire fixation element is coupled to the plurality of electrical wires and configured to fix the electrical wires relative to each other so that the electrical wires do not move relative to each other
Implementation Method 2
The wire fixation element comprises an electrically-conductive bridge in contact with and electrically coupling together the ground layers of the coaxial wires and the wire slug
Implementation Method 3
each electrically coupled directly to a corresponding one of the solder balls of the BGA component
Data Source
AI summary
An electrical device that includes a ball grid array (BGA) component, comprising signal processing circuitry, a component mounting surface, and a BGA, which has solder balls that are spaced apart from each other on the component mounting surface. The electrical device also includes a plurality of electrical wires, each electrically coupled directly to a corresponding one of the solder balls of the BGA component. The electrical device further includes a wire fixation element, through which the plurality of electrical wires at least partially pass through. The wire fixation element is coupled to the plurality of electrical wires and configured to fix the electrical wires relative to each other so that the electrical wires do not move relative to each other.