Power Module Mounting Geometry to Prevent Assembly Mix-Ups
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Solution Overview
Problem
When different power modules are mounted on the same control substrate, there is a risk of erroneous mounting, where a power module intended for one circuit is mistakenly mounted in another circuit.
Innovation Solution
The power semiconductor device includes a plurality of power modules with first and second protruding portions, and a heat sink with corresponding recessed portions. The recessed portions are designed to engage with the protruding portions, preventing incorrect mounting by ensuring each power module is positioned correctly relative to the heat sink and control substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If different power modules are mounted in each of three circuits accommodated on one control substrate, then the control substrate can be downsized by using power modules suitable for each circuit's output voltage requirements, but there is a risk that a power module intended for one circuit is mounted in another circuit by mistake
Solution Approach 1:
The invention applies asymmetry by providing different positioning structures for different power module types. Specifically, each power module type has a unique combination of positioning protrusions and corresponding recesses on the control substrate, making each module type geometrically incompatible with incorrect mounting locations. This asymmetric design ensures that only the correct power module type can be physically mounted in its designated circuit position, thereby preventing erroneous mounting while maintaining a compact control substrate layout.
2Reliability
If the same power module type is used in all three circuits, then erroneous mounting can be avoided, but the control substrate becomes unnecessarily large to accommodate the largest power module
Solution Approach 1:
The invention applies local quality by customizing the control substrate layout for each circuit's specific power module type. Each circuit position on the control substrate is designed with localized positioning features (specific protrusions and recesses) that match only its designated power module type. This allows the control substrate to be optimized locally for each circuit's voltage and power requirements, minimizing the overall substrate size while preventing incorrect module installation through geometric constraints.
Data Source
AI summary
A power semiconductor device includes: a plurality of power modules including control terminals; a heat sink, on which the plurality of power modules are mounted; and a control substrate, to which the control terminals are fixed. The plurality of power modules each include a first protruding portion close to the control terminals, and a second protruding portion far from the control terminals. The heat sink has, at a position corresponding to the first protruding portion, a first recessed portion formed to have an inner diameter larger than an outer diameter of the first protruding portion, and engaged with the first protruding portion. At a position corresponding to the second protruding portion, the heat sink has a second recessed portion formed to have the shape of an elongated hole whose minor diameter is larger than an outer diameter of the second protruding portion, and engaged with the second protruding portion.