Electrostatic Chuck Ball Mounting for Miss-Free Fine-Pitch Placement
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Solution Overview
Problem
Existing methods struggle to accurately and efficiently mount very small conductive balls onto a substrate using an electrostatic chuck, often resulting in missed balls due to their small size and light weight.
Innovation Solution
A method involving a horizontally arranged mask with mounting grooves and through holes, an electrostatic chuck, and a ball supply module, where the electrostatic chuck operates to mount conductive balls into the grooves and then increases the distance to drop them onto the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a mask with mounting holes is used to mount very small conductive balls, then the number of conductive balls that can be mounted increases, but the accuracy of mounting each ball at the target position deteriorates
Solution Approach 1:
The mask is divided into multiple mounting holes arranged in a matrix pattern, allowing simultaneous mounting of many conductive balls while each hole maintains precise positioning capabilities
Solution Approach 2:
An electrostatic chuck is introduced as an intermediary device between the mask and conductive balls to provide precise positioning and controlled release, ensuring accurate mounting even as quantity increases
2Quantity of substance
If the size of conductive balls is reduced to increase integration, then the number of balls that can be mounted increases, but the ease of mounting each ball deteriorates
Solution Approach 1:
The mechanical gravity-based dropping method is replaced with an electrostatic field-based positioning and release system, allowing precise control of very small conductive balls that are too light to be effectively handled by mechanical means alone
3Device complexity
If a general dropping method is used to transfer conductive balls from mask to substrate, then the process is simple, but the reliability of successful mounting deteriorates
Solution Approach 1:
The electrostatic chuck serves as a mediator that reliably transfers conductive balls from the mask to the substrate through controlled electrostatic release, significantly improving mounting reliability while maintaining relatively simple process integration
Solution Approach 2:
The system monitors the mounting process to detect missed balls and performs re-mounting operations, ensuring high reliability through feedback-based quality control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-quality mounting of small conductive balls onto a substrate without missing any, effectively addressing the challenges of small size and light weight.
Implementation Method 1
mounting the conductive balls accommodated in the ball supply module into the mounting grooves by operating the electrostatic chuck
Implementation Method 2
mounting the conductive balls on the substrate by increasing the distance between the electrostatic chuck and the mask to drop the conductive balls mounted in the mounting grooves of the mask onto the substrate
Data Source
AI summary
Provided is a conductive ball mounting method using an electrostatic chuck. According to the conductive ball mounting method using an electrostatic chuck, when the process of mounting conductive balls onto a substrate through mounting grooves formed in the mask is performed, the occurrence of process defects can be prevented and conductive balls having very small sizes can be effectively mounted on the substrate. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting conductive balls can be performed with high quality by preventing deformation of the mask without missing of some of the conductive balls. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting small sizes of conductive balls on the substrate can be effectively performed.