Embedded PCB Antenna Structure for Component Protection and Cooling
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Solution Overview
Problem
The challenge in manufacturing component embedded circuit boards is the potential damage to electronic components during the embedding process, which affects the reliability and integrity of the circuit board.
Innovation Solution
A method for manufacturing a component embedded circuit board with an antenna structure involves embedding a component into a printed circuit board using an adhesive and integrating an antenna structure with a dielectric layer, ensuring the component is securely positioned and heat dissipation is enhanced.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If electronic components are embedded into the circuit board to reduce overall thickness, then the circuit board becomes lighter and thinner, but the electronic components may be damaged during the embedding process
Solution Approach 1:
A cushioning layer is formed on the circuit board surface at the component embedding position before embedding the electronic component. This cushioning layer absorbs embedding pressure and prevents direct contact between the embedding tool and the electronic component, thereby preventing damage to the component during the embedding process while enabling the circuit board to achieve reduced thickness.
2Length of stationary object
If electronic components are embedded into the circuit board to reduce overall thickness, then the circuit board becomes lighter and thinner, but the embedding process may cause damage to the components
Solution Approach 1:
A cushioning layer is formed on the circuit board surface at the component embedding position before embedding the electronic component. This cushioning layer absorbs embedding pressure and prevents direct contact between the embedding tool and the electronic component, thereby preventing damage to the component during the embedding process while enabling the circuit board to achieve reduced thickness.
3Strength
If adhesive is used to secure the component in the embedding position, then the component is firmly fixed, but heat dissipation from the component may be compromised
Solution Approach 1:
The adhesive layer is segmented into two functional zones: a first adhesive region that provides strong bonding between the circuit board and the electronic component for secure fixation, and a second adhesive region with different properties that facilitates heat dissipation. This segmentation allows the adhesive structure to simultaneously achieve both strong component fixation and effective heat management.
Solution Approach 2:
Different regions of the adhesive layer are assigned different properties: the first adhesive region is optimized for bonding strength to secure the component, while the second adhesive region is optimized for thermal conductivity to enable heat dissipation. This local differentiation of material properties allows the adhesive layer to perform multiple functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents damage to electronic components during embedding, enhances heat dissipation, and ensures reliable signal transmission through the integrated antenna structure.
Implementation Method 1
embedding a component into a printed circuit board using an adhesive
Data Source
AI summary
A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.