Surface-Mount Transmission Line Capacitor for Tailored 20-60 GHz Response

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Solution Overview

Problem

Existing wire-bond transmission line capacitors lack the ability to tailor frequency responses over their useful frequency range, failing to meet current desirable operational requirements.

Innovation Solution

The development of a surface mount transmission line capacitor with a monolithic substrate, electrodes, a dielectric layer, and terminal layers, configured for grid array type mounting, which exhibits improved high-frequency performance by allowing tailored responses over the device's frequency range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If wire-bond transmission line capacitors are used, then basic capacitive function is achieved, but the ability to tailor frequency responses over the useful frequency range is lost

Engineering Contradiction:

Improvefrequency response tailoring capabilityVSAvoiddevice structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The device is segmented into multiple functional layers (monolithic substrate, first electrode, dielectric layer, second electrode, terminal layers) that can be independently designed and optimized. This segmentation allows each layer to contribute specifically to frequency response characteristics while maintaining overall device functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements dynamic frequency response tailoring by varying the dielectric layer thickness and material properties across different regions of the capacitor. This creates frequency-dependent impedance characteristics that can be optimized for specific frequency ranges while maintaining basic capacitive function.

Inventive Principle:

Principle #15Dynamics

2Reliability

If traditional transmission line capacitors are used, then DC blocking and RF bypassing functions are provided, but insertion loss exceeds acceptable levels at high frequencies (20-60 GHz)

Engineering Contradiction:

Improvehigh-frequency performanceVSAvoidinsertion loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent replaces traditional wire-bond mechanical connections with a planar monolithic structure where electrodes and terminals are directly formed on the substrate. This eliminates mechanical wire bonds that cause high-frequency losses, achieving insertion loss better than -1.0 dB across the 20-60 GHz range while maintaining DC blocking and RF bypassing functions.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If surface mount configuration is used, then ease of mounting is improved, but electrical connection complexity increases

Engineering Contradiction:

Improvemounting easeVSAvoidelectrical connection structure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The terminal layers are designed to serve multiple functions: they provide electrical connections to the electrodes, establish surface mount contact points for easy mounting, and can be configured for different mounting styles (grid array, flip chip). This multi-functionality simplifies the overall connection structure while maintaining ease of mounting.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the electrical connection function with the mounting function by integrating terminal layers that simultaneously serve as both electrical contacts and mechanical mounting surfaces. This consolidation reduces the number of separate components and simplifies the mounting process while maintaining low insertion loss.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The surface mount transmission line capacitor achieves an insertion loss greater than −1.0 dB for frequencies ranging from 20 GHz to 60 GHz, providing enhanced high-frequency performance and tailored frequency responses.

Implementation Method 1

a dielectric layer arranged between the first electrode and second electrode

Methodology Applied

Scientific EffectDielectric polarization: Dielectric

Data Source

PatentUS12213243B2Transmission line capacitor and circuit board including the same embedded within

Publication Date: 2025.01.28 KYOCERA AVX COMPONENTS CORP

AI summary

A surface mount transmission line capacitor can have excellent high frequency performance characteristics. The surface mount transmission line capacitor can include a monolithic substrate having a surface, a first electrode formed over the surface, a second electrode arranged over the first electrode, a dielectric layer arranged between the first electrode and second electrode, a first terminal layer exposed along the surface of the substrate and electrically connected with the first electrode, and a second terminal layer exposed along the surface of the substrate and electrically connected with the second electrode. The first terminal layer and the second terminal layer can be contained within a perimeter of the surface of the monolithic substrate.