PCB Assembly Insert With Backup Path for Heat and Current Flow
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Solution Overview
Problem
Existing circuit board assemblies face challenges in achieving optimal heat dissipation and current carrying capacity, particularly when using discrete components on printed circuit boards (PCBs), due to limitations in pin connections which have poor heat conduction and limited current carrying capacity.
Innovation Solution
The proposed circuit board assembly incorporates an insert made of high thermal conductivity and current-carrying capacity material, such as copper, which is partially inserted into apertures on the PCB. This insert is connected to the semiconductor device via both a primary and a secondary connection, ensuring electrical and thermal communication even if the primary connection fails.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete components are connected to PCB using pin connections, then the assembly is simple to manufacture, but the current carrying capacity is limited and heat dissipation is poor
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated copper insert structure. The copper insert serves both as an electrical conductor for high current carrying capacity and as a heat sink for effective heat dissipation, replacing the separate pin connections and heat sink components that would otherwise be needed.
Solution Approach 2:
The patent employs a copper insert that combines high electrical conductivity and high thermal conductivity properties in a single material component. This composite material approach allows the connection structure to simultaneously achieve excellent current carrying capacity and heat dissipation performance, overcoming the limitations of standard pin connections.
2Ease of manufacture
If discrete components are connected to PCB using pin connections, then the assembly is simple to manufacture, but heat dissipation is poor
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated copper insert structure. The copper insert serves both as an electrical conductor for high current carrying capacity and as a heat sink for effective heat dissipation, replacing the separate pin connections and heat sink components that would otherwise be needed.
Solution Approach 2:
The patent employs a copper insert that combines high electrical conductivity and high thermal conductivity properties in a single material component. This composite material approach allows the connection structure to simultaneously achieve excellent current carrying capacity and heat dissipation performance, overcoming the limitations of standard pin connections.
3Reliability
If an insert is added to improve current carrying capacity and heat dissipation, then electrical and thermal performance improve, but device complexity increases
Solution Approach 1:
The copper insert is designed as a multi-functional component that simultaneously provides electrical connection, thermal management, and mechanical support functions. This universal component approach eliminates the need for separate pins, heat sinks, and mounting structures, thereby improving current carrying capacity and heat dissipation while actually reducing overall device complexity.
Solution Approach 2:
The patent merges the electrical connection function and thermal management function into a single integrated copper insert structure. The copper insert serves both as an electrical conductor for high current carrying capacity and as a heat sink for effective heat dissipation, replacing the separate pin connections and heat sink components that would otherwise be needed.
4Device complexity
If a primary connection is used for electrical connection, then the connection is simple, but reliability decreases if the connection fails
Solution Approach 1:
The patent implements a secondary backup connection path through additional copper traces and vias that are pre-established but remain dormant during normal operation. If the primary electrical connection fails, the circuit can automatically switch to the secondary connection path, providing fault tolerance and maintaining system reliability without adding complex active protection circuits.
Solution Approach 2:
The patent changes the electrical connection parameter from a single-point pin connection to a distributed multi-path copper trace connection. This parameter change increases the redundancy and reliability of the electrical connection by providing multiple parallel conduction paths, while maintaining simplicity through the use of standard PCB fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies manufacturing, enhances current-carrying capacity, and improves heat dissipation, while also providing a 'limp home' functionality in case of primary connection failure, ensuring minimal functionality and reduced heat dissipation.
Implementation Method 1
an insert made of a material with a high thermal conductivity coefficient and high current-carrying capacity (e.g., copper), is at least partially inserted into at least one of the apertures
Implementation Method 2
an insert made of a material with a high thermal conductivity coefficient and high current-carrying capacity (e.g., copper)
Implementation Method 3
In an embodiment, a layer of a sintering compound is attached to the insert, which is used to achieve a flat, current-carrying connection with the PCB
Data Source
AI summary
A circuit board assembly, which includes an insert, a printed circuit board (PCB), the insert connected to the PCB, at least one semiconductor device, a primary connection between the insert and the semiconductor device, and a secondary connection between the insert and the semiconductor device. The secondary connection provides electrical and thermal communication between the semiconductor device and the insert when the primary connection fails. The primary connection between the insert and the semiconductor device is a sintered connection. The insert and the semiconductor device are in electrical and thermal communication with one another through the sintered connection. The sintered connection includes a sintering compound which connects the insert and the semiconductor device. The secondary connection includes a limp-home function if the primary connection fails.