Electronic Component Module With High-Melting Solder Ball Stability
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Solution Overview
Problem
The existing electronic component module structures, where solder balls are formed first and then electronic components are mounted, often result in deformation due to heat, leading to reduced mountability and bondability to other circuit boards.
Innovation Solution
The module uses a substrate with a solder ball made of high-melting-point solder on one surface and lower-melting-point solder for mounting electronic components, ensuring the solder ball is not remelted during component mounting, thereby preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a solder ball is formed first and then an electronic component is mounted, then the external connection terminal is established, but the solder ball may be deformed due to heat during mounting
Solution Approach 1:
The patent changes the material parameter of the solder ball by using a high-melting-point solder material instead of conventional low-melting-point solder. This parameter change ensures that the solder ball remains solid and maintains its spherical shape during the reflow soldering process, preventing deformation while still allowing electronic components to be mounted using conventional lower-melting-point solder.
2Reliability
If the solder ball deforms, then the external connection terminal shape is deformed, but this reduces mountability and bondability to other circuit boards
Solution Approach 1:
The patent applies parameter changes by selecting a high-melting-point solder material for the solder ball, which maintains its shape integrity during component mounting processes. This ensures that the external connection terminal retains its proper spherical shape, thereby preserving mountability and bondability to other circuit boards.
3Manufacturing precision
If a high-melting-point solder is used for the solder ball, then the solder ball is not remelted during component mounting, but this requires different solder materials
Solution Approach 1:
The patent applies local quality by using different solder materials for different purposes: a high-melting-point solder specifically for the solder ball that requires shape stability, and conventional lower-melting-point solder for mounting electronic components. This localized material differentiation allows each component to have the optimal material properties for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces deformation of the solder ball and maintains high mountability and bondability to other circuit boards, enhancing the reliability of the electronic component module.
Implementation Method 1
A melting point of the first solder is higher than a melting point of the second solder
Data Source
AI summary
An electronic component module includes a substrate including a first main surface and a second main surface, and using a side near the second main surface as a mounting side, an external terminal by a solder ball made of first solder, on the second main surface, and a first electronic component mounted by using second solder, on the first main surface, and a melting point of the first solder is higher than a melting point of the second solder.