Light Emitting Device Spherical Conductive Member Mounting
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Solution Overview
Problem
The production of small-sized light emitting devices with high mountability and efficiency is hindered by the time and cost-intensive processes of plating for electrodes and wiring layers, which also reduce efficiency and increase the risk of manufacturing errors.
Innovation Solution
A light emitting device configuration featuring a light emitting element with electrodes exposed through holes in a light-reflecting substrate, where substantially spherical electrically conductive members are bonded to the electrodes and coated with adhesive portions to secure them within the substrate, eliminating the need for precise positioning and reducing manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plating or similar processes are used to produce electrodes and wiring layers, then electrical connectivity and reliability are improved, but production time and costs increase, reducing manufacturing efficiency
Solution Approach 1:
The patent extracts the complex plating process entirely by using pre-formed spherical conductive members that are simply placed into holes in the substrate. This eliminates the time-consuming plating steps while maintaining electrical connectivity through the spherical members that bond directly to electrodes via eutectic bonding or similar mechanisms.
Solution Approach 2:
The conductive members are prepared in advance as spherical objects with predetermined electrical properties and bonding characteristics. This preliminary preparation allows them to be directly used in the final assembly without requiring on-site plating or wiring formation, significantly improving manufacturing efficiency.
2Reliability
If plating processes are used to create wiring layers, then electrical conductivity is improved, but production costs and time consumption increase
Solution Approach 1:
The patent uses relatively simple spherical conductive members instead of complex plating processes. These spherical members can be manufactured through less expensive means (such as spheroidizing metal particles or using molten metal drops) and provide sufficient electrical conductivity for the application without requiring the precision and time investment of traditional plating.
Solution Approach 2:
The patent replaces the electrochemical plating system with a mechanical placement system where spherical conductive members are positioned and bonded to electrodes. This substitution eliminates the need for plating baths, chemical treatments, and precise control of plating parameters, simplifying the manufacturing process.
3Reliability
If precise positioning is required for conductive members in holes, then connection reliability is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent uses spherical conductive members whose geometry provides inherent positioning advantages. The spherical shape allows the members to settle into the holes with natural alignment, and the curvature enables reliable bonding contact with the electrode surfaces without requiring extremely precise positioning. The spheres can accommodate minor variations in hole position while maintaining electrical connection.
Solution Approach 2:
The spherical conductive members exhibit self-positioning behavior when placed in the holes. Their spherical geometry and bonding characteristics allow them to automatically align and bond with the electrodes without requiring complex external positioning mechanisms or highly precise placement, reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the cost-effective and efficient production of small-sized light emitting devices with high reliability, reducing the risk of short circuits and improving mountability by simplifying the manufacturing process and eliminating the need for precise positioning of conductive members.
Implementation Method 1
a substantially spherical core arranged in the hole and bonded with the electrode
Implementation Method 2
a coating portion provided in a space between the substantially spherical core and a lateral surface of the hole
Data Source
AI summary
A light emitting device includes a light emitting element, a light-reflecting substrate, and an electrically conductive member. The light emitting element includes a first surface and an electrode provided on the first surface. The light-reflecting substrate has a first main surface facing the first surface of the light emitting element and has a second main surface opposite to the first main surface. The light-reflecting substrate defines a hole at a position corresponding to the electrode. The hole penetrates through the light-reflecting substrate from the first main surface to the second main surface. The electrically conductive member includes a substantially spherical core arranged in the hole and bonded with the electrode, and a coating portion provided in a space between the substantially spherical core and a lateral surface of the hole.