Bottom-Side Power Connector Layout for High-Voltage PCB Modules

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Solution Overview

Problem

Conventional high-voltage power connectors for computing processing boards are bulky and require removal of the entire board for connection changes, occupying valuable space and risking damage, and often interfere with other components due to their vertical design and limited space for connection.

Innovation Solution

A low-profile connector module attached to a power cable that interfaces with the bottom side of a voltage regulator, allowing for a bottom-side power input that is removable and compliant with PCB keep-out requirements, thereby freeing up space on the top side for processing elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a conventional multi-pin connector package is mounted to the top of the board, then high voltage power input can be achieved, but the connector module becomes bulky and occupies valuable board space

Engineering Contradiction:
Improvehigh voltage power input capabilityVSAvoidboard space occupation
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The patent inverts the conventional power connector positioning by moving it from the top side to the bottom side of the PCB. This allows the power connection to be made through the voltage regulator module from underneath the board, freeing up top-side board space for computing resources while maintaining high voltage power input capability

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions the power connector from a top-side vertical insertion design to a bottom-side horizontal connection approach. The power cable connects to the voltage regulator from the bottom of the board, utilizing the unused bottom surface area and eliminating the need for top-side board removal during connection changes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Power

If a conventional power connector is positioned proximate a top side edge of the board, then power connection is achieved, but valuable board trace space is occupied and interference with other computing elements occurs

Engineering Contradiction:
Improvepower connection capabilityVSAvoidboard trace space
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The patent extracts the power connector from its conventional top-side location near board edges and repositions it to the bottom side of the board. This separates the power connection function from the computing resource areas, eliminating interference with computing elements and freeing up board trace space

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If technicians need to change power connection, then the entire board must be removed, but this risks damage to board elements and increases downtime

Engineering Contradiction:
Improvepower connection accessibilityVSAvoidboard element protection
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent segments the power connection system from the main board by positioning the power connector and cable assembly separately at the bottom side. This allows the power cable to be disconnected and replaced independently without removing or risking damage to the board elements, improving both ease of operation and reliability

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and space-saving high-power delivery to computing processing boards by utilizing unconventional bottom-side power input, minimizing signal interference and parasitic losses, and allowing for easy replacement without damaging the board.

Implementation Method 1

a cable configured to conduct a direct current (DC) voltage from an upstream DC converter source

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12183999B2Separable interface cable structure for high voltage under-module power input
Publication Date: 2024.12.31 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US12183999B2 patent drawing
  • US12183999B2 patent drawing
  • US12183999B2 patent drawing

AI summary

A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.