Thin IC Module Structure Without Cover Film for Easier Mounting
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Solution Overview
Problem
Existing IC modules face challenges in achieving a thin, flat, and protected form due to the difficulties in handling thin substrates and the thickness increase caused by cover films, which affects their integration and functionality in electronic devices.
Innovation Solution
The IC module design incorporates a substrate with lands connected to terminal electrodes and an insulator layer that covers the substrate's surface, where the insulator layer's thickness is closer to the IC's thickness, providing protection and flexibility while avoiding the need for a cover film, allowing for a thinner module with improved handling and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin substrate is used to reduce the thickness of the IC module, then the overall thickness is reduced, but the substrate becomes difficult to handle and mount the IC on
Solution Approach 1:
The patent applies this principle by using a thin substrate (6μm to 12μm) that maintains flexibility while providing sufficient mechanical support. The substrate is designed to be thin enough to reduce overall module thickness but thick enough to remain handleable during manufacturing processes.
2Reliability
If a cover film and adhesive layer are added to protect and flatten the IC, then the IC is protected and flattened, but the overall thickness increases
Solution Approach 1:
The patent merges the protective function and flattening function into the substrate itself. The substrate serves as both the mounting base and the protective/flatting element, eliminating the need for separate cover films and thick adhesive layers. The insulator layer (10μm to 20μm) provides additional protection without requiring a separate cover film structure.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: mechanical support, IC mounting base, protective covering, and surface flattening. This multi-functionality eliminates the need for additional dedicated protective layers, thereby reducing overall thickness.
3Length of moving object
If the substrate is thinned to reduce module thickness, then the module becomes thinner, but it becomes difficult to mount the IC on the substrate
Solution Approach 1:
The patent optimizes the substrate thickness parameter to a specific range (6μm to 12μm) that balances thinness with manufacturability. Additionally, the insulator layer thickness is controlled (10μm to 20μm) to provide sufficient support during IC mounting while maintaining overall module thinness. These parameter optimizations enable IC mounting on thin substrates without requiring complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a thinner IC module with moderate flexibility, protecting the IC and preventing thickness increase, thus enhancing the module's structural integrity and ease of handling while maintaining functionality.
Implementation Method 1
an anisotropic conductive paste to be electrically connected is formed by pressurization and heating in the opening of the insulator layer
Implementation Method 2
an insulator layer covering an area outside of a formation area of the land on the first surface of the substrate
Data Source
AI summary
An IC module is provided that includes an IC having a terminal electrode, and a substrate having a first surface and a second surface opposite to each other and having a land formed on the first surface. Moreover, the land is connected to the terminal electrode of the IC. On the first surface of the substrate, an insulator layer that covers an area outside of a formation area of the land is formed. A difference between a thickness of the insulator layer and a thickness of the IC is smaller than a difference between the thickness of the insulator layer and a thickness of the substrate, and the thickness of the substrate is smaller than the thickness of the insulator layer.