Bridge Chiplet Circuit Board for Dense Chip-to-Chip Interconnects
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Solution Overview
Problem
Conventional multi-chip modules face challenges in increasing chip-to-chip interconnects due to the complexity and cost associated with high-density design rules, 3D stacking, and embedded interconnect bridges (EMIBs), which also lack through-board connectivity.
Innovation Solution
A circuit board with a substrate having a pocket and a conductor layer, where a chiplet with bottom side interconnects connected to the conductor layer and top side interconnects for chip-to-chip connections is positioned. This configuration provides both high-density interconnects and through-board pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional high-density design rules are used across all regions of a package substrate to increase chip-to-chip interconnects, then the number of interconnects increases, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The invention divides the substrate into multiple regions with different design rules. A first region contains a first plurality of interconnects formed with first design rules, while a second region contains a second plurality of interconnects formed with second design rules that are different from the first design rules. This segmentation allows optimization of each region for its specific function, reducing overall manufacturing complexity while maintaining high interconnect density where needed.
2Quantity of substance
If 3D stacking with through-silicon-vias is used to increase chip-to-chip interconnects, then interconnect density increases, but manufacturing complexity and cost increase
Solution Approach 1:
The invention applies different design rules and interconnect structures to different regions of the substrate based on local requirements. The first region may use through-silicon-vias or other complex structures where high density is critical, while the second region uses simpler structures where lower density is acceptable. This local optimization reduces overall manufacturing difficulty while achieving the required total number of interconnects.
3Quantity of substance
If embedded interconnect bridges (EMIB) are used for chip-to-chip interconnects, then interconnect capability improves, but through-board connectivity is lost and routing penalty increases
Solution Approach 1:
The invention creates a substrate structure that serves multiple functions simultaneously. The substrate provides both chip-to-chip interconnect capability through the first and second pluralities of interconnects, and through-board connectivity through conductor traces that extend through the substrate. This multi-functional design eliminates the routing penalty associated with EMIBs while maintaining high interconnect density.
Data Source
AI summary
Various circuit boards and methods of fabricating and using the same are disclosed. In one aspect, a circuit board is provided that has a substrate with a pocket and a conductor layer. A chiplet is positioned in the pocket. The chiplet has plural bottom side interconnects electrically connected to the conductor layer and plural top side interconnects adapted to interconnect with two or more semiconductor chips.