Modular Unit Cell Assembly for Custom PCB Fabrication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing batch process for producing printed circuit boards is costly and time-consuming, making it inefficient for custom or 'produce-by-demand' manufacturing, as it requires expensive photolithography equipment and limited materials that result in lower performance compared to solid insulators and metals.
Innovation Solution
A system for assembling interconnect substrates using pre-processing units to manufacture and sort unit cells, which are then aligned and bonded using image transfer and post-processing units to form a multi-layer circuit board, allowing for flexible material selection and layer configuration, including thermoplastic insulators and conductive lines, enabling efficient production of custom circuit designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional batch photolithography process is used, then manufacturing efficiency and cost-effectiveness are improved, but flexibility for custom production and material selection are worsened
Solution Approach 1:
The patent segments the printed circuit board manufacturing process into independent modular units: a pickup unit that selects individual unit cells, a bonding unit that bonds them to the substrate, and a heating unit that cures the adhesive. Each unit cell is a self-contained module with conductive traces and vias. This segmentation enables flexible, on-demand production of custom circuit boards by simply changing the sequence or selection of unit cells, while maintaining high throughput through parallel processing of multiple unit cells.
Solution Approach 2:
The patent changes the fundamental parameters of the manufacturing process by transitioning from photolithography to direct bonding of pre-fabricated unit cells. This allows the use of diverse materials including thermoplastic insulators and various conductive materials without requiring expensive photomask sets. The process parameters such as bonding temperature, pressure, and adhesive composition can be adjusted to accommodate different material combinations and circuit design requirements.
2Adaptability or versatility
If solution-processed materials are used in ink jet printing, then production flexibility and reduced retooling costs are improved, but material performance and density are worsened
Solution Approach 1:
The patent applies preliminary action by pre-fabricating unit cells with conductive traces and vias before assembly. These unit cells can be manufactured using optimized processes that ensure high material density and performance. During the main manufacturing process, these pre-fabricated units are simply picked up and bonded to the substrate, maintaining both high performance and production flexibility.
Solution Approach 2:
The patent uses composite materials by combining thermoplastic insulator materials with conductive materials in the unit cells. The thermoplastic material provides structural support and electrical insulation, while the conductive materials (which can be solution-processed or otherwise) provide the circuit pathways. This composite approach allows the use of high-performance materials in critical areas while maintaining overall production flexibility.
3Manufacturing precision
If photolithography equipment and reticles are used, then manufacturing precision is improved, but equipment cost and setup time are worsened
Solution Approach 1:
The patent uses copying by replicating standardized unit cell designs that can be reused across multiple circuit board productions. Instead of creating new photomasks for each custom board design, the same unit cell masters can be used repeatedly. The pickup unit selectively picks and places these standardized units to create different circuit configurations, maintaining precision through the standardized design while eliminating the need for expensive custom photolithography equipment.
Data Source
AI summary
A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.