Optical Module Packaging with Vertical Stacking and Lead Frame Cooling
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Solution Overview
Problem
The challenge in the field of electronic product packaging is to further reduce the volume of packaging structures as electronic products become thinner and smaller.
Innovation Solution
The proposed optical module packaging structure includes a circuit board, an electronic component, a lead frame, and a light emitting module, where the electronic component and light emitting module are vertically stacked, and the lead frame acts as an electrical and thermal connector between the light emitting module and the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic products become thinner and smaller, then product size is reduced, but packaging structure volume reduction becomes more difficult
Solution Approach 1:
The patent transitions from a traditional planar layout to a three-dimensional stacked configuration. The light emitting module is positioned vertically above the circuit board, with the lead frame extending upward to connect them. This vertical stacking approach reduces the horizontal footprint and overall packaging volume while maintaining all necessary electrical and thermal connections.
Solution Approach 2:
The lead frame serves multiple functions simultaneously: it provides electrical connection between the light emitting module and circuit board, acts as a structural support for the vertically stacked components, and functions as a thermal conduction path to dissipate heat. This multi-functionality reduces the need for separate components, thereby reducing overall packaging volume.
2Area of stationary object
If vertical stacking is implemented, then plane space is reduced, but thermal management becomes more challenging
Solution Approach 1:
The lead frame acts as an intermediary thermal conduction path between the light emitting module and the circuit board. It provides a direct thermal pathway that efficiently transfers heat away from the light emitting module, solving the heat dissipation challenge created by the vertical stacking configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the plane space occupied by the packaging structure, enables miniaturization of electronic products, and provides effective heat dissipation due to the lead frame's thermal conductivity.
Implementation Method 1
the lead frame acts as an electrical and thermal connector between the light emitting module and the circuit board
Implementation Method 2
one end of the first connection portion is electrically connected to the circuit board through a solder
Data Source
AI summary
An optical module packaging structure is provided, which includes a circuit board, an electronic component, a lead frame and a light emitting module. The electronic component is disposed on the circuit board. The lead frame is disposed on the electronic component, in which the lead frame has a first connection portion electrically connected to the circuit board. The light emitting module is disposed on the lead frame, in which the light emitting module includes a first connection pad located at a bottom of the light emitting module, and the first connection pad is electrically connected to the circuit board through the first connection portion of the lead frame. A method of manufacturing the aforementioned optical module packaging structure is also provided.