Magnetic-Coupled Modular Substrate for Reusable PCB Assembly
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Solution Overview
Problem
The high cost and complexity of manufacturing advanced substrates for electronic devices, such as multilayer printed circuit boards (PCBs), which are essential for miniaturized electronic components, pose a significant challenge in the field of electronics packaging.
Innovation Solution
A device substrate with a multi-layer PCB configuration, featuring a pattern of magnetic material deposits on its surface, allows for the surface mounting of electronic components via magnetic coupling. This configuration enables easy attachment and detachment of semiconductor packages and passive devices, facilitating reuse and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If advanced device mounting technologies and high-density laminate substrates are used to achieve increased device density, then device density is improved, but manufacturing cost and complexity increase significantly
Solution Approach 1:
The substrate is divided into multiple laminated layers, each potentially serving different functions. The magnetic material deposits are segmented into specific patterns on the outer surface, allowing selective magnetic coupling at designated locations while keeping other areas simple for electrical connections.
Solution Approach 2:
The substrate structure integrates multiple functions: electrical interconnect pads for electrical connections, magnetic material deposits for magnetic coupling, and a laminated layer structure providing both mechanical support and electrical pathways. This multi-functional design reduces the need for separate components and complex assembly processes.
2Quantity of substance
If advanced device mounting technologies and high-density laminate substrates are used to achieve increased device density, then device density is improved, but manufacturing cost increases significantly
Solution Approach 1:
The substrate is divided into multiple laminated layers, each potentially serving different functions. The magnetic material deposits are segmented into specific patterns on the outer surface, allowing selective magnetic coupling at designated locations while keeping other areas simple for electrical connections.
Solution Approach 2:
The substrate structure integrates multiple functions: electrical interconnect pads for electrical connections, magnetic material deposits for magnetic coupling, and a laminated layer structure providing both mechanical support and electrical pathways. This multi-functional design reduces the need for separate components and complex assembly processes.
3Ease of operation
If magnetic material deposits are added to the substrate surface, then ease of assembly and disassembly is improved, but substrate complexity increases
Solution Approach 1:
Magnetic material deposits are applied only at specific locations on the outer surface of the substrate, rather than uniformly across the entire surface. This localized approach provides magnetic coupling functionality only where needed for component attachment, while leaving other areas simple for electrical connections and signal routing.
Solution Approach 2:
The substrate combines traditional PCB laminated layers with magnetic material deposits on the surface, creating a composite structure that integrates electrical and magnetic functionalities in a single component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic coupling mechanism allows for secure and reliable attachment of electronic components to the substrate, enabling efficient assembly and disassembly, which reduces manufacturing costs and extends the lifecycle of complex substrates.
Implementation Method 1
each magnetic material deposit of the first plurality of magnetic material deposits is attracted by a magnetic force to a magnetic material deposit of the second plurality of magnetic deposits
Data Source
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Figure 5
AI summary
System (600) comprising a multi-layer PCB (500) and a device (100) connected to the PCB. The device comprises an electronic component (102) that is mounted on a first surface of a substrate (106), the substrate comprising a plurality of through-hole vias (108) that connect the contacts of the electronic component from the first surface of the substrate to the second surface. The connection between the PCB and the device is implemented by means of magnetic deposits (116, 506) that are provided on both the second surface of the substrate and the contacting surface of the PCB.