Molded Electronic Module Terminals for Reliable Encapsulated Connections
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Solution Overview
Problem
Encapsulated electronic modules, such as power converters, face challenges in providing reliable and efficient external connections to internal conductive features, which is essential for heat management and electrical connectivity, but existing methods often result in insulation issues and mechanical integrity problems.
Innovation Solution
The method involves forming terminal holes in the encapsulant layer to expose conductive features, inserting conductive terminals, and creating electrical connections through soldering or pressure fit, with optional conductive metal layers on the exterior and interior surfaces to ensure robust electrical contacts and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If terminal holes are formed in the encapsulant layer to expose conductive features, then external electrical connections are enabled, but insulation issues and mechanical integrity problems may occur
Solution Approach 1:
The terminal structure is segmented into multiple functional zones: the encapsulant layer forms the insulating matrix, terminal holes create localized conductive pathways, conductive metal layers line the hole walls, and conductive terminals provide external connection points. This segmentation allows each component to perform its specific function without compromising overall reliability.
Solution Approach 2:
Conductive metal layers serve as intermediaries between the encapsulant material and the conductive terminals. These metal layers are deposited on the interior surfaces of terminal holes, creating a reliable conductive bridge that maintains both electrical connectivity and mechanical stability while preserving the insulating properties of the encapsulant.
2Reliability
If conductive terminals are inserted into terminal holes and soldered, then reliable electrical connections are established, but manufacturing complexity increases
Solution Approach 1:
Conductive metal layers are deposited on the interior surfaces of terminal holes before inserting the conductive terminals. This preliminary action prepares the connection interface in advance, ensuring that when terminals are inserted and soldered, reliable electrical connections are immediately established without requiring additional complex manufacturing steps.
3Reliability
If conductive metal layers are formed on exterior and interior surfaces, then robust electrical contacts are ensured, but manufacturing steps increase
Solution Approach 1:
The formation of conductive metal layers is merged into the terminal hole creation process. The same manufacturing steps that form terminal holes also deposit conductive metal layers on the interior surfaces, and the exterior surface metallization is integrated with the terminal insertion and soldering process. This merging reduces the total number of discrete manufacturing steps while ensuring robust electrical contacts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable external connections while maintaining insulation and mechanical support, enhancing thermal management and electrical performance by ensuring conductive paths are established effectively without compromising the module's integrity.
Implementation Method 1
forming an electrical connection between the conductive terminal and the respective portions of the one or more conductive features exposed within each of the one or more terminal holes
Implementation Method 2
forming an electrical connection between the conductive terminal and the respective portions of the one or more conductive features exposed within each of the one or more terminal holes
Data Source
AI summary
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.