3D Multispectral Imaging Sensor Monolithic Layering

Solution Overview

Problem

Current multispectral imaging technologies face challenges such as high cost, complex manufacturing, required optical alignment, limited field of view, and increased weight, particularly in applications like space exploration.

Innovation Solution

A three-dimensional multispectral imaging sensor is developed with a monolithic structure comprising multiple layers of light detecting materials, each optimized for non-overlapping wavelength ranges (visible, near-infrared, and mid-infrared) without the need for optical alignment, using materials like Cadmium Sulfide, Lead(II) Sulfide, and Lead(II) Selenide, and optically transparent interlayers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate lenses and filters are used for different detectors, then multispectral imaging capability is achieved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvemultispectral imaging capabilityVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple spectral detection capabilities into a single integrated sensor array where different detector elements respond to different wavelength ranges (UV, visible, IR) without requiring separate lenses and filters for each spectral channel. This merging of functions reduces the overall device complexity while maintaining multispectral imaging capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The sensor array employs detector elements with different spectral responses that can detect multiple wavelength ranges simultaneously. This multi-functional approach allows a single sensor structure to perform UV, visible, and infrared detection, eliminating the need for separate optical paths and components for each spectral band.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If separate lenses and filters are used for different detectors, then multispectral imaging capability is achieved, but manufacturing difficulty increases

Engineering Contradiction:

Improvemultispectral imaging capabilityVSAvoidmanufacturing difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple spectral detection capabilities into a single integrated sensor array where different detector elements respond to different wavelength ranges (UV, visible, IR) without requiring separate lenses and filters for each spectral channel. This merging of functions reduces the overall device complexity while maintaining multispectral imaging capability.

Inventive Principle:

Principle #5Merging (Combining)

3Measurement precision

If optical alignment for multiple channels is required, then spectral separation is achieved, but device complexity and alignment precision requirements increase

Engineering Contradiction:

Improvespectral separationVSAvoidalignment requirements

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical optical alignment system (separate lenses and filters requiring precise alignment) with an electronic/detector-based spectral separation approach. Different detector elements inherently respond to different wavelength ranges, eliminating the need for complex mechanical alignment while achieving precise spectral separation through the detectors' intrinsic spectral selectivity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Adaptability or versatility

If multiple separate detection systems are used, then comprehensive spectral coverage is achieved, but weight increases

Engineering Contradiction:

Improvespectral coverageVSAvoidsensor weight

Core Design Contradiction:

Adaptability or versatilityVSWeight of moving object

Solution Approach 1:

The patent combines multiple spectral detection capabilities into a single integrated sensor array where different detector elements respond to different wavelength ranges (UV, visible, IR) without requiring separate lenses and filters for each spectral channel. This merging of functions reduces the overall device complexity while maintaining multispectral imaging capability.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution results in a low-cost, lightweight, and high-field-of-view imaging sensor with reduced manufacturing complexity, addressing the limitations of existing technologies.

Implementation Method 1

Each of the layers is formed from light detecting materials for detecting light of respective different non-overlapping wavelengths

Methodology Applied

Scientific EffectPhotoelectric absorption: Photoelectric Effect

Data Source

PatentUS10276626B2Three-dimensional integrated multispectral imaging sensor

Publication Date: 2019.04.30 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

A three-dimensional multispectral imaging sensor and method for forming a three-dimensional multispectral imaging sensor are provided. The three-dimensional multispectral imaging sensor includes a monolithic structure having a plurality of layers. Each of the layers is formed from light detecting materials for detecting light of respective different non-overlapping wavelengths and having respective different bandgaps.