3D Nonvolatile Memory Device with Layered Drive Circuits
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Solution Overview
Problem
Current nonvolatile memory devices with three-dimensional architectures face challenges in efficiently integrating and reducing the size of drive circuits and power consumption while maintaining stable write operations.
Innovation Solution
The proposed nonvolatile memory device employs a three-dimensional structure with memory cells and drive circuits arranged in specific layers, utilizing magnetic tunnel junction elements and drive circuits with p-channel and n-channel transistors to control write operations, allowing for reduced transistor size and lower drive voltage, thereby enhancing integration and power efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If drive circuits are integrated below the memory cell array in a three-dimensional structure, then integration density is improved, but circuit size and power consumption are not sufficiently reduced
Solution Approach 1:
The patent transitions from planar integration to three-dimensional integration by stacking drive circuits and memory cell arrays in different layers. Word line drive circuits are positioned in a first layer while memory cells are in a second layer above them, with bit line drive circuits in a third layer. This vertical arrangement increases integration density without proportionally increasing power consumption.
Solution Approach 2:
The drive circuits are segmented into separate functional blocks: word line drive circuits in the first layer and bit line drive circuits in the third layer. This segmentation allows independent optimization of each circuit block, enabling reduced transistor sizes and lower power consumption while maintaining stable write operations through coordinated control.
2Area of stationary object
If transistor size is reduced to enhance integration, then device area is improved, but write operation stability deteriorates
Solution Approach 1:
The patent applies different design optimizations to different parts of the system. In the drive circuits, transistor sizes are reduced for compactness, while in the memory cell layer, the magnetic tunnel junction elements are precisely engineered with specific tunnel barrier thicknesses and magnetic layer configurations to ensure stable write operations. This local optimization allows small transistors to coexist with reliable memory cell switching.
Solution Approach 2:
The patent introduces select gates as intermediary elements between the drive circuits and memory cells. These select gates act as buffers that amplify and condition the drive signals, ensuring that even with reduced transistor sizes in the drive circuits, the final write operations remain stable and reliable when applied to the memory cells.
3Use of energy by moving object
If drive voltage is reduced to lower power consumption, then energy usage is improved, but write operation capability deteriorates
Solution Approach 1:
The patent optimizes multiple parameters simultaneously: it reduces drive voltage to lower power consumption while compensating by adjusting magnetic tunnel junction parameters such as tunnel barrier thickness and magnetic layer composition. This allows the system to achieve low-power operation without sacrificing write capability, as the magnetic elements are engineered to switch at lower voltage thresholds.
Solution Approach 2:
The patent employs pulsed write operations where high current is applied briefly through the memory cells during write cycles. This periodic action allows sufficient write capability during the pulse duration while maintaining low average power consumption between pulses. The drive circuits are designed to deliver high peak currents only when needed for writing, rather than maintaining continuously high power levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables highly integrated nonvolatile memory devices with reduced power consumption and stable write operations, achieving efficient data storage in a compact form.
Implementation Method 1
a memory cell that is disposed in a third layer located between the first layer and the second layer, and has a first terminal electrically connected to the first wiring line and a second terminal electrically connected to the second wiring line, the memory cell including a variable resistance element having a resistance that varies when a write current flows from one of the first terminal and the second terminal to the other
Data Source
AI summary
A nonvolatile memory device of an embodiment includes: a first wiring line extending in a first direction; a second wiring line extending in a second direction intersecting the first direction; a memory cell disposed between the first layer and the second layer, and has first and second terminals, the memory cell including a variable resistance element; a first drive circuit capable of supplying a first potential and a second potential lower than the first potential; a second drive circuit supplying a third potential having a different polarity from a polarity of the first potential; a third drive circuit capable of supplying the second potential and a fourth potential higher than the second potential; a fourth drive circuit supplying a fifth potential having a different polarity from a polarity of the first potential; and a control circuit electrically connected to the first to fourth drive circuits.


