3D Semiconductor Package Conductive Structure for Heat Dissipation
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Solution Overview
Problem
In three-dimensional (3D) stacked semiconductor device packages, heat generated from the die mounted to the upper substrate accumulates due to a long dissipation path, leading to potential die failure.
Innovation Solution
Incorporation of a conductive structure on the lower circuit layer to transfer heat directly to the lower substrate, reducing the heat dissipation path and providing electromagnetic shielding between electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat flows through the upper substrate, interposer and lower substrate to reach the main board, then the heat dissipation path is established, but the path is too long causing heat accumulation
Solution Approach 1:
The heat dissipation path is segmented into multiple independent paths: one through the substrate and interposer, and another direct path through the conductive structure embedded in the lower substrate. This segmentation allows heat to bypass the long traditional path and take a shorter route, reducing heat accumulation at critical points.
Solution Approach 2:
A conductive structure is introduced as an intermediary element within the lower substrate to facilitate direct heat transfer from the die to the main board. This intermediary creates a thermal shortcut that complements the traditional heat dissipation path, effectively reducing the overall thermal resistance and path length.
2Productivity
If electronic components are densely packed in 3D stacked configuration, then integration density is improved, but heat accumulation occurs due to long dissipation path
Solution Approach 1:
The conductive structure is embedded within the lower substrate in a three-dimensional configuration, creating additional thermal conduction pathways that operate in parallel with the traditional two-dimensional heat dissipation route. This dimensional approach allows heat to escape through multiple spatial paths, effectively managing thermal loads in densely packed 3D stacked packages.
3Temperature
If conductive structure is added for heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The conductive structure is merged with the lower substrate, combining the substrate's mechanical support function with the conductive structure's thermal management function. This integration allows the same component to serve dual purposes, reducing overall package complexity while maintaining effective heat dissipation. The conductive structure becomes an inherent part of the substrate architecture rather than a separate additive element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency and reduces warpage of the upper substrate while maintaining electromagnetic integrity, thereby preventing heat accumulation and improving package stability.
Implementation Method 1
a conductive structure configured to transfer heat generated from the first electronic component to the lower circuit layer
Implementation Method 2
to provide electromagnetic shielding between the second electronic component and the third electronic component
Data Source
AI summary
A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first circuit layer, a second circuit layer under the first circuit layer, a first electronic component between the first circuit layer and the second circuit layer and connected to the first circuit layer and a sub-package between the first circuit layer and the second circuit layer and connected to the second circuit layer. The sub package comprises a second electronic component under the first electronic component and a conductive structure configured to dissipate heat generated from the first electronic component.