3D-Printed PCB on Heat Sink Assembly for Low-Resistance Power Paths
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Solution Overview
Problem
Current power electronics packages face limitations in achieving high power density due to traditional lamination and machining processes, which restrict the size and aspect ratio of vias, leading to suboptimal thermal and electrical performance.
Innovation Solution
The method involves 3D-printing a circuit board directly on a cold plate with bonded power devices, allowing for asymmetric geometry and the deposition of conductive and insulating materials in unconstrained patterns, eliminating the need for layer-by-layer formation and enabling single large conductive paths for improved thermal and electrical efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional lamination and machining processes are used to form PCBs and embed power devices, then manufacturing precision and structural integrity are maintained, but power density and thermal management performance are limited
Solution Approach 1:
The patent changes the fundamental manufacturing approach from traditional lamination and machining to additive manufacturing (3D printing). This parameter change enables direct formation of complex 3D circuit board structures with integrated power devices, achieving power density exceeding 400 kW/L at 80 kW while eliminating multiple sequential manufacturing steps including lamination, drilling, and embedding operations
Solution Approach 2:
The patent merges the circuit board formation process with power device integration into a single additive manufacturing operation. The 3D printer deposits conductive and insulating materials layer-by-layer to simultaneously create the PCB structure and embed power devices, consolidating what were previously separate manufacturing operations into one unified process
2Reliability
If traditional lamination processes are used to form PCBs, then manufacturing precision is maintained, but thermal and electrical resistance paths are suboptimal
Solution Approach 1:
The patent changes the manufacturing method from lamination to additive manufacturing, which eliminates the via size and aspect ratio constraints inherent in traditional PCB fabrication. The 3D printing process can directly deposit conductive material in optimized paths and shapes, creating superior thermal and electrical conduction pathways without being limited by drilling and plating parameters
Solution Approach 2:
The patent transitions from 2D PCB layer construction to 3D additive manufacturing. This dimensional change allows conductive materials to be deposited in complex three-dimensional paths and shapes, optimizing thermal and electrical resistance paths in multiple directions simultaneously rather than being constrained to planar layer-by-layer construction with fixed via geometries
3Productivity
If 3D-printing is used to form the circuit board on power devices, then power density exceeds 400 kW/L and thermal management is enhanced, but manufacturing precision and material deposition control become more challenging
Solution Approach 1:
The patent applies local quality by using a multi-material 3D printing system that can deposit different materials (conductive and insulating materials) with different properties in different locations. The system precisely controls material deposition to create conductive paths where needed and insulating barriers where required, optimizing local electrical and thermal properties throughout the integrated structure
Solution Approach 2:
The patent implements feedback control in the additive manufacturing process to maintain manufacturing precision. The system monitors material deposition in real-time and adjusts printing parameters to ensure accurate placement of conductive and insulating materials, compensating for variations in material properties, temperature, and printing conditions to achieve the required precision for high power density applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves a power density exceeding 400 kW/L at 80 kW, enhancing thermal management and reducing electrical and thermal resistance paths, compared to traditional laminated PCBs.
Implementation Method 1
printing, using a 3D-printer, a circuit board on and around the power devices
Implementation Method 2
bonding a power device to a first surface of a cold plate
Data Source
AI summary
A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.