3D PCB Dielectric Molding for Uniform High-Current Traces
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Solution Overview
Problem
Conventional PCB manufacturing processes result in non-uniform trace cross-sections, material wastage, and inefficient electrical circuits due to etching and chemical recovery methods, which are hazardous and energy-intensive, and existing additive methods are unsuitable for high current applications.
Innovation Solution
The use of a 3D dielectric substrate with channels and pockets filled with conductive material via electrolytic metallization, allowing for specific thickness control and minimal material usage, enabling the formation of efficient conductive layers without the limitations of commercial copper foils, and allowing for the creation of multi-layer PCB structures with improved thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional etching process is used to form PCB traces, then traces can be formed with standard manufacturing methods, but the trace cross-section becomes non-uniform with tapered side walls resulting in volume loss and higher resistance
Solution Approach 1:
Instead of removing material to form traces (etching), the invention deposits conductive material into recesses to build up traces. The mold cavities are formed with draft angles, and conductive material is electrolytically deposited to fill these cavities, creating uniform cross-section traces with vertical or near-vertical side walls, completely reversing the conventional approach.
Solution Approach 2:
The invention transitions from planar trace formation to three-dimensional trace construction by forming recesses with controlled depths and filling them with conductive material. This allows precise control of trace cross-sectional geometry including uniform thickness and vertical side walls, adding a depth dimension to trace formation.
2Ease of manufacture
If conventional etching and material removal processes are used, then PCB traces can be formed, but conductive material is lost and requires hazardous chemical recovery methods that are energy intensive
Solution Approach 1:
The mold cavities and recesses are pre-formed in the dielectric substrate before conductive material deposition. This preliminary structuring ensures that conductive material is deposited only where needed, eliminating material loss from etching and simplifying recovery since excess material can be removed mechanically without hazardous chemicals.
Solution Approach 2:
The invention extracts the conductive material deposition step from the conventional etching process. Instead of forming traces by removing dielectric material, the process deposits conductive material into pre-formed recesses, separating the trace formation function from material removal and eliminating the need for hazardous chemical recovery.
3Reliability
If thicker copper foil is used to carry high currents, then current carrying capability is improved, but the PCB structure becomes thicker and thermal dissipation is hindered
Solution Approach 1:
Instead of uniformly increasing foil thickness throughout the PCB, the invention locally deposits conductive material only in the recesses where traces are needed. This allows high current carrying capability in trace regions while maintaining thinner overall PCB structure in non-trace areas, preserving thermal dissipation pathways through the dielectric substrate.
Solution Approach 2:
The invention controls trace thickness in the vertical dimension by controlling recess depth and deposition parameters, rather than increasing overall PCB thickness. This allows high current traces with sufficient cross-sectional area while maintaining thin PCB overall structure for better thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more efficient electrical circuits with reduced resistance, minimal material waste, and improved thermal conductivity, making it suitable for high current applications without the need for hazardous chemicals or energy-intensive processes.
Implementation Method 1
depositing by electrolytic metallization the conductive traces and pads into the channels and pockets of the 3D dielectric substrate
Data Source
AI summary
A method of manufacturing a printed circuit board (PCB) includes forming a tridimensional (3D) dielectric substrate on a fiber-reinforced polymer with opposite sides; forming each side with channels and pockets by molding dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB; forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth; forming side walls of the channels and pockets of the 3D dielectric substrate with a draft angle in a range of greater than 0 degrees to about 5 degrees; depositing by electrolytic metallization the conductive traces and pads into the channels and pockets of the 3D dielectric substrate; and the outer surface of those conductive traces and pads are flush with the sides of the 3D dielectric substrate.