3D Photonic Package Structure for Lower-Loss Optical Coupling
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Solution Overview
Problem
Current photonic packages face challenges in reducing optical loss and improving communication efficiency due to edge-mounted optical fibers and thermal management limitations, particularly in integrating optical and electrical components effectively.
Innovation Solution
The development of three-dimensional photonic packages with waveguides formed on a substrate, where a portion of the substrate is replaced by a dielectric material like silicon oxide, reducing optical loss and enhancing thermal management, and incorporating photonic components such as grating couplers for efficient optical communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If edge-mounted optical fibers are used in photonic packages, then optical signal transmission is achieved, but optical loss increases and communication efficiency decreases
Solution Approach 1:
The patent transitions from edge-mounted optical fibers (2D surface mounting) to bottom-mounted optical fibers (3D subsurface integration). By extending fiber mounting into the vertical dimension through the substrate thickness, the invention achieves better optical coupling and reduced loss while improving communication efficiency.
Solution Approach 2:
The patent introduces waveguides formed within the substrate as intermediary structures that channel optical signals from bottom-mounted fibers to photonic components. These waveguides act as mediators that reduce optical loss by providing dedicated optical pathways rather than relying on edge-mounted fiber connections.
2Adaptability or versatility
If optical and electrical components are integrated in photonic packages, then full-fledged applications are enabled, but thermal management becomes challenging
Solution Approach 1:
The patent separates optical components (photonic die) and electrical components (electronic die) into distinct substrates mounted on a common carrier. This segmentation allows each component type to be optimized for its specific thermal requirements while still achieving functional integration through the carrier platform.
Solution Approach 2:
The patent uses a common carrier as an intermediary platform that hosts both photonic and electronic dies. This carrier acts as a mediator that enables thermal management for both component types simultaneously, allowing heat dissipation paths to be independently optimized for each die type while maintaining system integration.
3Ease of manufacture
If conventional photonic package structures are used, then manufacturing is simpler, but optical loss is higher and performance is limited
Solution Approach 1:
The patent performs preliminary actions by forming waveguides and mounting optical fibers at the substrate level before final package assembly. By pre-integrating these optical infrastructure elements into the substrate, the invention reduces optical loss while maintaining manufacturing feasibility through standardized processing sequences.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces optical loss, improves communication efficiency, and provides high-speed data transfer by effectively integrating optical and electrical signals within the photonic packages, enhancing the overall performance of photonic systems.
Implementation Method 1
a portion of the substrate is replaced by a dielectric material like silicon oxide, reducing optical loss
Implementation Method 2
incorporating photonic components such as grating couplers for efficient optical communication
Data Source
AI summary
A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.