3D Printed Functional Parts with Embedded Electronics
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Solution Overview
Problem
Current electronics manufacturing in the U.S. faces challenges due to high labor costs and lax environmental regulations abroad, leading to outsourcing, while traditional PCB production is time-consuming and environmentally harmful, necessitating a more efficient and environmentally friendly manufacturing method.
Innovation Solution
A direct-write 3D printing technique that extrudes and deposits structural and conductive filaments to create complex 3D structures with embedded electronics, allowing for rapid production of functional parts with reduced material waste and integration of multiple printing methods for diverse components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional PCB manufacturing methods are used, then production capacity and established processes are maintained, but manufacturing time increases and environmental harm occurs
Solution Approach 1:
The patent replaces traditional mechanical PCB manufacturing processes (etching, milling, chemical processing) with additive fabrication technology that deposits conductive materials and electronic components directly onto the substrate, eliminating the need for subtractive mechanical operations and chemical etching processes
Solution Approach 2:
The invention changes the fundamental manufacturing parameter from batch processing (traditional PCB) to additive layer-by-layer construction, enabling rapid prototyping while maintaining production capacity through digital control and automated deposition processes
2Ease of manufacture
If traditional PCB manufacturing is used, then established production methods are maintained, but environmental harm increases due to chemical processes
Solution Approach 1:
The patent substitutes chemical etching and mechanical milling processes with additive deposition methods that use controlled material placement, eliminating the need for harmful chemicals and reducing environmental pollution while maintaining manufacturing simplicity
Solution Approach 2:
The invention extracts and removes the harmful chemical processes from the manufacturing system, retaining only the essential functions of material deposition and component integration through cleaner additive methods
3Productivity
If outsourcing manufacturing overseas is pursued, then labor costs are reduced, but environmental regulations become more lax and competitiveness increases
Solution Approach 1:
The patent creates a universal manufacturing platform that combines structural fabrication, electronic component integration, and interconnect formation in a single additive system, enabling domestic production to achieve the efficiency previously only available through overseas outsourcing
Solution Approach 2:
The invention merges multiple manufacturing operations (structural part fabrication, electronics assembly, wiring) into a single additive manufacturing process, consolidating previously distributed overseas supply chain activities into one domestic production step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the rapid production of complex 3D functional parts with embedded electronics, reducing material waste and environmental impact, while potentially bringing manufacturing back to the U.S. by eliminating the need for costly tooling and unskilled labor, and offering a more sustainable alternative to traditional subtractive manufacturing.
Implementation Method 1
A 3D printer comprises two or more computer-controlled modular printheads removeably mounted adjacent to each other. Each printhead includes at least one nozzle for extruding and depositing structural and/or functional filaments.
Data Source
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Figure 2A
Figure 2B
AI summary
A printed 3D functional part includes a 3D structure comprising a structural material, and at least one functional electronic device is at least partially embedded in the 3D structure. The functional electronic device has a base secured against an interior surface of the 3D structure. One or more conductive filaments are at least partially embedded in the 3D structure and electrically connected to the at least one functional electronic device.