3D-Printed PCB on Cold Plate for High-Density Power Modules
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Solution Overview
Problem
Existing methods for forming integrated power electronics packages, such as lamination and machining processes, are limited in achieving high power density beyond 400 kW/L at 80 kW, due to constraints in via size and aspect ratio, and layer-by-layer formation.
Innovation Solution
The method involves bonding power devices to a cold plate and 3D-printing a circuit board directly on and around the power devices, allowing for asymmetric geometry and the deposition of conductive and insulating materials in unconstrained patterns, eliminating the need for traditional via structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional lamination and machining processes are used to form PCBs and embed power devices, then manufacturing precision and reliability are maintained, but power density is limited to below 400 kW/L
Solution Approach 1:
The patent merges the PCB formation process with power device embedding into a single 3D-printing operation. The circuit board is printed directly around and around the power devices, eliminating the need for separate lamination and machining steps. This integration enables power densities exceeding 400 kW/L while reducing overall process complexity.
Solution Approach 2:
The invention changes the fundamental manufacturing parameter from layer-by-layer lamination to additive 3D-printing. This parameter change allows for asymmetric geometries and direct deposition of conductive and insulating materials around power devices, achieving higher power density without being constrained by traditional via size and aspect ratio limitations.
2Volume of stationary object
If lamination processes are used to form PCBs with embedded power devices, then structural integrity is maintained, but volume is reduced and power density exceeds 400 kW/L
Solution Approach 1:
The 3D-printing process applies local quality by depositing conductive and insulating materials in specific locations around each power device. This allows for asymmetric geometries tailored to each device's thermal and electrical requirements, eliminating the need for standardized via structures and achieving precise material placement without aspect ratio constraints.
Solution Approach 2:
The invention transitions from 2D layer-by-layer PCB formation to 3D additive manufacturing. The circuit board is printed in three dimensions around the power devices, allowing conductive and insulating materials to be deposited in unconstrained patterns. This dimensional change eliminates via aspect ratio limitations and enables direct integration with power devices.
3Temperature
If traditional PCB formation methods are used, then manufacturing reliability is maintained, but thermal management efficiency is insufficient
Solution Approach 1:
The patent merges thermal management functionality directly into the PCB structure through 3D-printing. Insulating and conductive materials are deposited in patterns that simultaneously provide electrical insulation and thermal pathways, eliminating the need for separate thermal interfaces and grease layers. This integration improves thermal management efficiency while reducing the number of interfaces.
4Power
If 3D-printing is used to form circuit boards on power devices, then power density exceeds 400 kW/L and thermal management improves, but manufacturing precision challenges arise
Solution Approach 1:
The invention changes the manufacturing approach from subtractive machining to additive 3D-printing, fundamentally altering the precision requirements. Instead of drilling and plating vias with strict aspect ratio constraints, the process deposits conductive and insulating materials layer-by-layer in unconstrained patterns, achieving high precision through controlled material deposition rather than mechanical machining.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the achievement of power densities exceeding 400 kW/L at 80 kW, while also improving thermal management and reducing the volume of the power module by eliminating unnecessary layers and grease interfaces.
Implementation Method 1
printing, using a 3D-printer, a circuit board on and around the power devices
Implementation Method 2
bonding power devices to a cold plate... improving thermal management
Data Source
AI summary
A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.